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Chemical reinforced glass for electronic device and preparation method thereof

A technology for strengthening glass and electronic devices, which is applied in the field of chemical strengthening glass and its preparation, can solve problems such as gaps, and achieve the effect of high scratch resistance and high impact resistance

Active Publication Date: 2018-02-06
CAIHONG GRP SHAOYANG SPECIAL GLASS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, although the strength of the glass has been improved to a certain extent in the prior art, compared with the industry's requirements for high strength at low temperature, high thermal shock resistance and a short strengthening time, an ideal compressive stress layer depth can be obtained There is still a certain gap in the expectation of strengthened glass with high surface compressive stress, so it is still a challenge to study glass preparation methods with low temperature, high strength and excellent performance parameters.

Method used

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  • Chemical reinforced glass for electronic device and preparation method thereof
  • Chemical reinforced glass for electronic device and preparation method thereof
  • Chemical reinforced glass for electronic device and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0034] A chemically strengthened glass for electronic devices, the composition of which consists of: 50% SiO in terms of overall mass percentage 2 , 25% Al 2 o 3 , 2% B 2 o 3 , 15% Na 2 O, 2% Li 2 O, 2% ZnO and 4% SnO 2 .

[0035] The specific production process is as follows:

[0036] Step 1: Select glass raw materials according to the mass percentage of the above components, mix them thoroughly, add them into a platinum crucible, melt and clarify them in a glass melting furnace, and melt them at 1500°C to form molten glass;

[0037] Step 2: pour the molten glass into the preheated metal mold, put the metal mold into the annealing furnace for annealing, and obtain a glass block, then cut and polish the glass block into glass pieces of 110*50*0.7mm.

[0038] Step 3: Clean the glass sheet surface prepared in step 2 with deionized water for 3 times and place it in a mixed melt of molten sodium nitrate and potassium nitrate at 390°C for ion exchange treatment for 5 hours,...

Embodiment 2

[0042] A chemically strengthened glass for electronic devices, the composition of which includes: 61% SiO in terms of overall mass percentage 2 , 20% Al 2 o 3 , 15% Na 2 O, 2% Li 2 O, 1% MgO and 1% SnO 2 .

[0043] The specific production process is as follows:

[0044] Step 1: Select glass raw materials according to the mass percentage of the above components, mix them thoroughly, add them into a platinum crucible, melt and clarify them in a glass melting furnace, and melt them at 1600°C to form molten glass;

[0045] Step 2: pour the molten glass into the preheated metal mold, put the metal mold into the annealing furnace for annealing, and obtain a glass block, then cut and polish the glass block into glass pieces of 110*50*0.7mm.

[0046] Step 3: Clean the glass sheet surface prepared in step 2 with deionized water for 3 times and place it in a mixed melt of molten sodium nitrate and potassium nitrate at 400°C for ion exchange treatment for 3.5 hours, wherein sodium ...

Embodiment 3

[0050] A chemically strengthened glass for electronic devices, the composition of which includes: 63.6% SiO in terms of overall mass percentage 2 , 1% B 2 o 3 , 12% Al 2 o 3 , 11% Na 2 O, 3% Li 2 O, 0.5% ZrO, 1.4% ZnO, 5% MgO and 2.5% SnO 2 .

[0051] The specific production process is as follows:

[0052] Step 1: Select glass raw materials according to the mass percentage of the above components, mix them thoroughly, add them into a platinum crucible, melt and clarify them in a glass melting furnace, and melt them at 1650°C to form molten glass;

[0053] Step 2: pour the molten glass into the preheated metal mold, put the metal mold into the annealing furnace for annealing, and obtain a glass block, then cut and polish the glass block into glass pieces of 110*50*0.7mm.

[0054] Step 3: Clean the glass sheet surface prepared in step 2 with deionized water for 4 times and then place it in a mixed melt of molten sodium nitrate and potassium nitrate at 420°C for ion excha...

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Abstract

The invention provides chemical reinforced glass for an electronic device and a preparation method thereof. An ideal compression stress layer depth is obtained at relatively low reinforcing temperature and relatively short reinforcing time. The method comprises the following steps: 1) taking raw materials: greater than or equal to 50 percent and less than or equal to 70 percent of SiO2, greater than or equal to 0 percent and less than or equal to 2 percent of B2O3, greater than or equal to 12 percent and less than or equal to 25 percent of Al2O3, greater than or equal to 11 percent and less than or equal to 15 percent of Na2O, greater than or equal to 0 percent and less than or equal to 5 percent of ZnO, greater than or equal to 2 percent and less than or equal to 5 percent of Li2O, greater than or equal to 0 percent and less than or equal to 5 percent of MgO, greater than or equal to 0 percent and less than or equal to 1 percent of ZrO2, greater than or equal to 1 percent and less than or equal to 4 percent of SnO2 and greater than or equal to 0.67 and less than or equal to 0.97 of (Na2O+Li2O) / (Al2O3+ZrO2+MgO); 2) melting and clarifying and carrying out ion change. The surface compressive stress of the reinforced glass is 882.4MPa to 990.5MPa, the surface stress layer depth is 80.5mu m to 96.3mu m, the Vickers hardness is 658kg / mm<2> to 690kg / mm<2> and the strain point temperature is 550.5 DEG C to 572.2 DEG C.

Description

technical field [0001] The invention relates to the technical field of glass manufacturing, in particular to a chemically strengthened glass used in electronic devices and a preparation method thereof. Background technique [0002] Mobile electronic display devices such as mobile phones and PDAs usually contain protective glass. Due to frequent contact and use, the protective glass must have good impact resistance and scratch resistance. However, during the production, processing and use of the glass, a large number of microcracks will occur on the surface. The existence of these microcracks makes the actual strength of the glass much lower than the theoretical strength. It is usually necessary to strengthen the glass surface to generate a compressive stress layer to improve the surface strength of the glass, thereby increasing the impact resistance and scratch resistance of the display device. [0003] At present, there are physical strengthening methods and chemical streng...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C03C21/00C03C3/093C03C3/085C03C3/083C03C3/091
CPCC03C3/083C03C3/085C03C3/091C03C3/093C03C21/002
Inventor 曾召刘仲军王答成
Owner CAIHONG GRP SHAOYANG SPECIAL GLASS CO LTD
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