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A kind of preparation method of phenylvinyl methyl MQ silicone resin for high folding LED encapsulation

A technology of phenylvinylmethyl and LED encapsulation, which is applied in the field of organosilicon polymer compounds, and can solve the problems of decreased light transmittance, yellowing of resin, and large internal stress of curing, etc.

Active Publication Date: 2021-09-03
山东盛宇新材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since epoxy resin contains a large number of aromatic rings, it will be oxidized to carbonyl and become a chromophore after absorbing ultraviolet rays, making the resin yellow.
In addition, epoxy resin will also change color when heated, which reduces the light transmittance in the near ultraviolet region and affects the luminous efficiency of LED light sources.
Moreover, epoxy resin itself absorbs moisture, is easy to age, has poor heat resistance, and has a large curing internal stress, which will affect the service life of the material, thereby affecting the life of the LED light source.

Method used

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  • A kind of preparation method of phenylvinyl methyl MQ silicone resin for high folding LED encapsulation
  • A kind of preparation method of phenylvinyl methyl MQ silicone resin for high folding LED encapsulation

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0018] Add 170 g of ethyl silicate, 111 g of hexamethyldisiloxane, 12 g of vinyl double caps, and 10 g of phenyl double caps in the three-necked flask, and mix well. At a reaction temperature of 10°C, 4 g of concentrated sulfuric acid and 30 g of water were slowly added dropwise. After 1 h of reaction, the temperature was raised to reflux for 4 h, and 40 wt % KOH solution was added dropwise to adjust the system to be neutral. Then distilled with toluene and filtered to obtain a clear and transparent silicone resin toluene solution. The toluene solvent was distilled off to obtain 270 g of a clear and transparent silicone resin with a phenyl vinyl network structure, with a yield of 89% and a vinyl content of 5%.

Embodiment 2

[0020] Add 170 g of ethyl silicate, 111 g of hexamethyldisiloxane, 15 g of vinyl double caps, and 10 g of phenyl double caps in the three-necked flask, and mix well. At a reaction temperature of 8° C., 4 g of concentrated sulfuric acid and 30 g of water were slowly added dropwise, and after 1 h of reaction, the temperature was raised to reflux for 5 h, and 50 wt % KOH solution was added dropwise to adjust the system to be neutral. Then distilled with toluene and filtered to obtain a clear and transparent silicone resin toluene solution. The toluene solvent was distilled off to obtain 280 g of a clear and transparent silicone resin with a phenyl vinyl network structure, with a yield of 91% and a vinyl content of 5.5%.

Embodiment 3

[0022] Add 170 g of ethyl silicate, 111 g of hexamethyldisiloxane, 10 g of vinyl double caps, and 10 g of phenyl double caps in the three-necked flask, and mix well. At a reaction temperature of 8°C, 4 g of concentrated sulfuric acid and 30 g of water were slowly added dropwise, and after 1 h of reaction, the temperature was raised to reflux for 6 h, and 60 wt % KOH solution was added dropwise to adjust the system to be neutral. Then distilled with toluene and filtered to obtain a clear and transparent silicone resin toluene solution. The toluene solvent was distilled off to obtain 265 g of a clear and transparent silicone resin with a phenyl vinyl network structure, with a yield of 88% and a vinyl content of 3%.

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Abstract

The invention relates to a preparation method of phenylvinylmethyl MQ silicone resin for high-fold LED packaging. In the method, ethyl silicate is hydrolyzed under the action of sulfuric acid or a solid acid catalyst to obtain silicic acid, further condensed, and then It can be terminated by reacting with phenyl double head and vinyl double head. After the reaction, reflux to make it highly cross-linked, then neutralize with lye and distill with toluene to finally obtain a toluene solution of phenyl vinyl methyl silicone resin. The reaction activity of this synthesis process is relatively low, easy to control, and the reaction speed is fast and the reaction is sufficient. Silicone resin with stable quality.

Description

technical field [0001] The invention relates to the technical field of organosilicon polymer compounds, in particular to a preparation method of phenylvinylmethyl MQ silicone resin for high-fold LED packaging. Background technique [0002] At present, most of the packaging materials used in high-fold LEDs are epoxy resins. Epoxy resins have excellent adhesion, electrical insulation, sealing and dielectric properties, and are low in cost, flexible in formula, easy to form, High production efficiency has become the mainstream material for low-power LED packaging. However, because epoxy resin contains a large number of aromatic rings, it will be oxidized into carbonyl and become a chromophore after absorbing ultraviolet rays, making the resin yellow. In addition, the epoxy resin will also change color when heated, which reduces the light transmittance in the near ultraviolet region and affects the luminous efficiency of the LED light source. Moreover, the moisture absorption ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08G77/20C08G77/08C08G77/06
CPCC08G77/06C08G77/08C08G77/20C08G77/70C08G77/80
Inventor 卢旭刘明强顾振涛原亚敏
Owner 山东盛宇新材料有限公司
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