A kind of preparation method of phenylvinyl methyl MQ silicone resin for high folding LED encapsulation
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- 山东盛宇新材料有限公司
- Publication Date
- 2021-09-03
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Abstract
Description
technical field
[0001] The invention relates to the technical field of organosilicon polymer compounds, in particular to a preparation method of phenylvinylmethyl MQ silicone resin for high-fold LED packaging. Background technique
[0002] At present, most of the packaging materials used in high-fold LEDs are epoxy resins. Epoxy resins have excellent adhesion, electrical insulation, sealing and dielectric properties, and are low in cost, flexible in formula, easy to form, High production efficiency has become the mainstream material for low-power LED packaging. However, because epoxy resin contains a large number of aromatic rings, it will be oxidized into carbonyl and become a chromophore after absorbing ultraviolet rays, making the resin yellow. In addition, the epoxy resin will also change color when heated, which reduces the light transmittance in the near ultraviolet region and affects the luminous efficiency of the LED light source. Moreover, the moisture absorption ...