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Surface-treated copper foil and copper-clad laminate or printed circuit board produced using same

A technology for printed wiring boards and copper clad laminates, used in printed circuits, printed circuit manufacturing, layered product processing, etc. Inferiority and other problems, to achieve the effect of low dielectric loss tangent, heat resistance and transmission characteristics

Active Publication Date: 2018-02-16
FURUKAWA ELECTRIC CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When such a copper foil is applied to a high-frequency circuit board, the contact area between the copper foil and the resin is increased, so that good adhesion can be ensured, but since the surface area of ​​the copper foil is too large, it is expected that the transmission characteristics will be poor. And no consideration has been given to reflow soldering heat resistance

Method used

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  • Surface-treated copper foil and copper-clad laminate or printed circuit board produced using same
  • Surface-treated copper foil and copper-clad laminate or printed circuit board produced using same
  • Surface-treated copper foil and copper-clad laminate or printed circuit board produced using same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0100] The surface treatment was performed on a copper foil substrate having a thickness of 18 μm without roughening (surface roughness Rz: approximately 1.1 μm) under the following conditions to produce a surface-treated copper foil.

[0101] (1) Formation of roughened layer

[0102] When the surface of the copper foil base is roughened, the roughening plating treatment 1 and the roughening plating treatment 2 shown below are sequentially performed to form a roughened layer.

[0103] (Roughening plating treatment 1)

[0104] It was implemented under the conditions shown in Table 1.

[0105] (Roughening plating treatment 2)

[0106]

[0107] (2) Formation of Ni-containing base layer

[0108] After forming a roughened layer on the surface of the copper foil base, electroplating is performed on the roughened layer under the Ni plating conditions shown below to form a base layer (Ni adhesion amount is 0.06mg / dm 2 ).

[0109]

[0110]

[0111] (3) Formation of Zn-containing heat-resistant trea...

Embodiment 2〕～〔 Embodiment 20

[0124] The roughening plating treatment 1 was performed under the conditions shown in Table 1, and the other treatments were performed under the same conditions as in Example 1.

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Abstract

Provided is a surface-treated copper foil and the like suitable for use in a copper-clad laminate or a printed circuit board adapted for enhanced performance and functionality of information communication devices supporting higher frequencies. The surface-treated copper foil M according to the present invention is laminated on and bonded to a first resin base material B1 having a dielectric constant of 2.6 to 4.0 to form a copper-clad laminate. The surface-treated copper foil has a surface-treated layer that satisfies condition 1 on a face to be bonded to the first resin base material B1. Condition 1: When the copper foil of the copper-clad laminate is completely dissolved by etching and the resulting surface of the first resin base material B1 is laminated with and bonded to a second resin base material B2, the bonding interface S between the first resin base material B1 and the second resin base material B2 has a height H of 0.15 to 0.85 mum and 11 to 30 projections and recesses per2.54 mum width.

Description

Technical field [0001] The present invention relates to a surface-treated copper foil and a copper-clad laminate or printed wiring board manufactured using the surface-treated copper foil. The surface-treated copper foil is suitable for high-frequency substrates such as wireless radars, high-speed computing machines, and portable devices. Suitable for servers, etc. Background technique [0002] In recent years, as computers and information communication equipment have increased in performance and functionality, and in addition, with the development of networking, in order to transmit and process large-capacity information at high speeds, there is a tendency for signals to gradually increase in frequency. This kind of information communication equipment uses copper clad laminate. The copper clad laminate is made by heating and pressing an insulating substrate (resin substrate) and copper foil. [0003] Generally, the insulating substrate constituting the copper-clad laminate for h...

Claims

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Application Information

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IPC IPC(8): C25D7/06B32B15/08B32B15/20H05K1/09
CPCB32B15/08B32B15/20C25D7/06H05K1/09B32B2310/04B32B2457/08C25D5/48C25D5/605H05K3/389
Inventor 佐藤章宇野岳夫座间悟
Owner FURUKAWA ELECTRIC CO LTD
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