Alkaline etching solution and preparation method thereof

An etching solution and alkaline technology, applied to the alkaline etching solution of metal copper on printed circuit boards, alkaline etching solution and its preparation field, can solve the problems of unstable etching rate, poor etching uniformity, etc., and achieve fast etching speed , Low cost of use, safe and environmentally friendly operation

Inactive Publication Date: 2018-02-27
佛山市华希盛化工有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] In the existing alkaline etching solution technology, inorganic compounds are generally used for compounding, resulting in unstable etching rate and poor etching uniformity

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0034] 100mL alkaline etching solution and its preparation method:

[0035] Ammonium chloride: 30g

[0036] Ammonium bicarbonate: 5g

[0037] Ammonia: 25% concentration, 48g

[0038] Additive: 0.4g

[0039] The balance is water.

[0040] Add ammonium chloride, ammonium bicarbonate, ammonia water, additives (urea, including urea, thiourea, dithiourea, etc.) into a beaker, add water to 100mL, stir evenly, and obtain an alkaline etching solution.

[0041] The parameter of gained etching solution is as follows:

[0042] Density, (20°C): 1.020-1.040

[0043] pH value: 9.5±0.5

[0044] Alkalinity, mol / L: 4.0-7.0

[0045] Chloride ion content, mol / L: 4.6-5.5

[0046] Chromaticity, degree: ≤20

[0047] Transparency: ≥140.

Embodiment 2

[0049] 1000L alkaline etching solution and its preparation method:

[0050] Ammonium chloride: 200-500Kg

[0051] Ammonium bicarbonate: 25-50Kg

[0052] Ammonia water: the concentration is 25%, 15-500Kg

[0053] Additives: less than 10Kg

[0054] The balance is water.

[0055] Add ammonium chloride, ammonium bicarbonate, ammonia water, additives (urea, including urea, thiourea, dithiourea, etc.) into a beaker, add water to 1000L, stir evenly, and obtain an alkaline etching solution.

[0056] The parameter of gained etching solution is as follows:

[0057] Density (20°C): 1.020-1.040

[0058] pH value: 9.5±0.5

[0059] Alkalinity: 4.0-7.0mol / L

[0060] Chloride ion content: 4.6-5.5mol / L

[0061] Chroma: ≤20

[0062] Transparency: ≥140.

[0063] This product belongs to low ammonia, high copper≧135g / L, fast copper etching speed (2-3ml / min), low side erosion, suitable for high-precision inner and outer layer etching, dense fine circuit board etching.

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Abstract

The invention discloses an alkaline etching solution. The alkaline etching solution is characterized by comprising, ammonium chloride, ammonium bicarbonate, aqua ammonia and an additive, wherein the additive is of the urea type. In the use process of the alkaline etching solution, the etching solution is alkaline, and the requirement for equipment is low; the use cost is low, operation is safe andenvironmentally friendly, and a detection control system is simple; side etching is low, the alkaline etching solution is suitable for production of dense and thin circuit boards, and the etching speed can be automatically controlled, the etching speed is high, and the stability is rapid.

Description

technical field [0001] The invention belongs to the technical field of metal etching, in particular to an alkaline etching solution and a preparation method thereof, in particular to an alkaline etching solution used for metal copper on a printed circuit board. Background technique [0002] The printed circuit board is an important electronic component and a carrier for the electrical connection of electronic components. With the development of modern science, the development level of printed circuit boards is an important symbol to measure the electronic information level of a country. [0003] The quality of printed circuit boards is directly related to the quality and service life of electronic equipment. If electronic equipment is used for civilian products, it is related to thousands of households. [0004] The function of the etching solution is to etch the copper surface on the substrate into a line shape. There are acidic and alkaline types. At present, the main c...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23F1/34
CPCC23F1/34
Inventor 蒙昌才黄远敏余欣荣谭奇亮詹校东李小丹
Owner 佛山市华希盛化工有限公司
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