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Vertical-cavity surface-emitting semiconductor laser and manufacturing method thereof

A technology of vertical cavity surface emission and fabrication method, applied in the field of vertical cavity surface emission semiconductor laser and its fabrication, can solve the problems of uneven current density, increase mode gain, increase mode loss, etc., and achieve high power and high stability The effect of single-mode output, increasing gain, and increasing loss

Active Publication Date: 2018-02-27
CHANGCHUN INST OF OPTICS FINE MECHANICS & PHYSICS CHINESE ACAD OF SCI
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  • Application Information

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Problems solved by technology

[0003] In order to obtain high power output, the light exit aperture of a single-tube vertical cavity surface emitting laser generally needs to be hundreds of microns, but the large-diameter light exit is likely to cause uneven current density at each point in the hole, especially the oxidation hole in the oxidation-limited layer. The current focusing phenomenon is easy to appear in the vicinity, resulting in uneven light emission in the light exit hole, forming a large far-field divergence angle, and affecting the beam quality of the laser
And in order to realize the single-mode output, there are usually two ways: (1) increase the mode gain difference, so that the gain of the fundamental mode is higher than the gain of the higher-order mode, and then achieve a single fundamental mode and a single vertical mode through a higher single-mode rejection ratio. mode lasing; (2) increase the mode loss difference, each mode of light will be lost during the propagation process, if the loss of the high-order mode can be realized greater than the loss of the fundamental mode, then single fundamental mode lasing can also be achieved
[0004] In the existing technology, VCSEL cannot achieve single-mode compatibility with high power and high efficiency, and can be mass-produced and applied

Method used

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  • Vertical-cavity surface-emitting semiconductor laser and manufacturing method thereof
  • Vertical-cavity surface-emitting semiconductor laser and manufacturing method thereof
  • Vertical-cavity surface-emitting semiconductor laser and manufacturing method thereof

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Embodiment Construction

[0052]The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0053] In order to make the above objects, features and advantages of the present invention more comprehensible, the present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0054] refer to figure 1 , figure 1 A schematic structural view of a vertical cavity surface emitting semiconductor laser provided for an embodiment of the present invention, the vertical cavity surface emitting s...

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Abstract

The invention discloses a vertical-cavity surface-emitting semiconductor laser and a manufacturing method thereof. A P type electrode structure comprises a transparent insulating layer, a transparentconducting layer and a grid electrode, wherein the transparent insulating layer and the grid electrode are provided with preset pattern structures to form a plurality of light outlets in array arrangement; for light outlet edge areas, high order modes of the light outlet edge areas can be eliminated by destructive interference, loss of the high order modes is increased, and loss of the air outletedge areas to a basic mode is smaller; an opening of a square frame serves as a central area of a through hole, only one transparent conducting layer is arranged on the central area, the transparent conducting layer in the central area is directly in contact with a P type DBR structure under the transparent conducting layer, current can be injected by the transparent conducting layer under the grid electrode, grain of the basic mode is increased, and gain of a set high order mode is smaller; thus, high-power and high-stability single mode emission can be achieved.

Description

technical field [0001] The present invention relates to the technical field of semiconductor devices, in particular to a vertical cavity surface emitting semiconductor laser and a manufacturing method thereof. Background technique [0002] Vertical cavity surface emitting laser is a new type of laser. Due to its good laser stability, coherence and beam quality, it is widely used in laser lighting, spectrometer, sensor, biomedicine, optical communication and other fields. With the further development of these fields, there are more and more requirements for semiconductor lasers (VCSEL). For example, laser lighting, lidar and other fields require high-power and high-efficiency VCSELs, and atomic clocks, optical communications and other fields require single-mode, high-beam Quality VCSELs. In recent years, the demand for high-power and high-efficiency single-mode output VCSELs has also increased. [0003] In order to obtain high power output, the light exit aperture of a sing...

Claims

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Application Information

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IPC IPC(8): H01S5/183H01S5/187H01S5/323
CPCH01S5/18313H01S5/187H01S5/32316
Inventor 张建伟张继业张星宁永强秦莉王立军
Owner CHANGCHUN INST OF OPTICS FINE MECHANICS & PHYSICS CHINESE ACAD OF SCI
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