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Fluororesin porous body, metal layer-equipped porous body using same, and wiring substrate

A technology of fluororesin and porous body, which is applied in the direction of metal layered products, synthetic resin layered products, porous dielectrics, etc. It can solve the problems of high relative dielectric constant and high relative dielectric constant of materials, and achieve excellent low relative dielectric constant. Excellent electric constant, industrial productivity, and excellent precision

Inactive Publication Date: 2018-03-27
NITTO DENKO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since the relative permittivity of inorganic substances is generally high, there is also a problem that the relative permittivity of the obtained material becomes high.

Method used

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  • Fluororesin porous body, metal layer-equipped porous body using same, and wiring substrate
  • Fluororesin porous body, metal layer-equipped porous body using same, and wiring substrate
  • Fluororesin porous body, metal layer-equipped porous body using same, and wiring substrate

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preparation example Construction

[0064] In the preparation of the paste in the step (I), when mixing the composition comprising the fluororesin, the hollow inorganic particles and the volatile additive, except that the composition only comprises the fluororesin, the hollow inorganic particle and the volatile additive, It also includes the case where a fluororesin, hollow inorganic particles, and volatile additives are combined with other auxiliary components.

[0065] Next, in the step (II), a molded body with a final target thickness (for example, a thickness of about 0.1 to 2 mm) is produced, and thereafter, the fluorine additive of the present invention can be obtained by removing the volatile additives in the step (III). Resin porous body. The removal of the volatile additive in the step (III) can be carried out by a method appropriately selected from known methods depending on the volatile additive used, and among them, it is preferable to remove the rolled sheet (sometimes referred to as a "film"). Sha...

Embodiment 1~3、 comparative example 1~2

[0089] The above-mentioned raw material components were compounded and mixed in the ratio shown in Table 1 below to prepare a porous body composition (paste), and the paste was rolled at room temperature (23° C.) to form a 150 μm sheet. This sheet was sintered at 400° C. to volatilize the volatile additives to produce a sheet-shaped porous fluororesin body having many pores (average pore diameter: 100 nm).

[0090] Using each of the sheets thus obtained, property evaluation was performed according to the method described later. The results are collectively shown in Table 1 below.

[0091]

[0092] The measurement frequency was set to 10 GHz, the complex permittivity was measured by the resonant cavity perturbation method, and the real number part (εr') was taken as the relative permittivity. Using a relative permittivity measuring device ("NetworkAnalyzer N5230C" manufactured by Agilent Technologie, and "Cavity Resonator 10GHz" manufactured by Kanto Electronic Application a...

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Abstract

In order to obtain a fluororesin porous body that has been difficult to realize in the past and that is an excellent material having both a low dielectric constant and a low linear expansion coefficient, and in order to obtain a metal layer-equipped porous body using the fluororesin porous body, and a wiring substrate, the present invention provides a fluororesin porous body comprising a fluororesin matrix and hollow inorganic particles dispersed in the fluororesin matrix, the fluororesin matrix having many holes.

Description

technical field [0001] The present invention relates to a fluororesin porous body which is a material capable of achieving both excellent low relative permittivity and low linear expansion coefficient, which has been difficult to obtain, a porous body with a metal layer and a wiring board using the same. Background technique [0002] With the development of electronic technology, electronic devices such as computers and mobile communication devices using high-frequency bands are gradually increasing. High-frequency wiring substrates used in such electronic equipment generally require low relative permittivity materials, and examples of low relative permittivity resin materials include: polyethylene, polypropylene, polystyrene, polytetrafluoroethylene and other non-polar polymer resin materials. [0003] However, the above-mentioned resin material has a high coefficient of linear expansion and is greatly different from that of the metal wiring material formed on the substrat...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08J9/14B32B5/18B32B15/082H05K1/03
CPCH05K1/034H05K2201/015H05K2201/0116C08J2205/042C08J9/32C08J2327/18C08J9/28C08J2201/0502B32B3/085B32B5/18B32B15/082C08J9/0066H05K1/0313B32B2264/10B32B2266/0235B32B2457/08C08J9/14H05K1/03B32B27/06C08J9/141H05K1/0306
Inventor 笠置智之北川祐矢
Owner NITTO DENKO CORP