Thermally conductive silica gel material for computer

A heat-conducting silica gel and computer technology, which is applied in the field of heat-conducting silica gel, can solve the problems of poor compression resistance, poor tensile performance, and poor thermal conductivity of heat-conducting silica gel, and achieve excellent compression resistance, lower density, and improved strength and thermal conductivity.

Inactive Publication Date: 2018-04-06
四川兴龙腾科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a thermally conductive silica gel material for computers, which sol

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0015] This embodiment provides a thermally conductive silicone material for computers, including 100 parts by weight of methyl vinyl silicone rubber, 5 parts by weight of aluminum powder, 10 parts by weight of photocurable adhesive, 10 parts by weight of silane coupling agent, vinyl trimethoxy 10 parts by weight of silane, 15 parts by weight of divinyl silicone oil, 10 parts by weight of heat-resistant agent, 3 parts by weight of flame retardant, 3 parts by weight of additive and 10 parts by weight of hollow glass microspheres with an outer diameter of less than 200 μm, wherein the resistant The thermal agent is composed of 50% fumed silica and 50% carbon black; the flame retardant filler is a mixture of aluminum hydroxide and magnesium hydroxide; the additives include: 5 parts by weight of aluminum powder, 20 parts by weight of copper powder, oxidized 1 part by weight of magnesium, 4 parts by weight of sodium sulfate, and 3 parts by weight of titanium dioxide.

Embodiment 2

[0017] This embodiment provides a thermally conductive silicone material for computers, including 100 parts by weight of methyl vinyl silicone rubber, 15 parts by weight of aluminum powder, 15 parts by weight of photocurable adhesive, 20 parts by weight of silane coupling agent, vinyl trimethoxy 20 parts by weight of silane, 20 parts by weight of divinyl silicone oil, 20 parts by weight of heat-resistant agent, 8 parts by weight of flame retardant, 8 parts by weight of additive and 30 parts by weight of hollow glass microspheres with an outer diameter of less than 200 μm, wherein the resistant The thermal agent is composed of 50% fumed silica and 50% carbon black; the flame retardant filler is a mixture of decabromodiphenyl ether, melamine and antimony oxide; the additives include: 15 parts by weight of aluminum powder, 25 parts by weight of copper powder parts, 3 parts by weight of magnesium oxide, 5 parts by weight of sodium sulfate, and 7 parts by weight of titanium dioxide....

Embodiment 3

[0019] This embodiment provides a thermally conductive silicone material for computers, including 100 parts by weight of methyl vinyl silicone rubber, 8 parts by weight of aluminum powder, 12 parts by weight of photocurable adhesive, 13 parts by weight of silane coupling agent, vinyl trimethoxy 13 parts by weight of silane, 16 parts by weight of divinyl silicone oil, 12 parts by weight of heat-resistant agent, 4 parts by weight of flame retardant, 5 parts by weight of additive and 13 parts by weight of hollow glass microspheres with an outer diameter of less than 200 μm, wherein the resistant The thermal agent is composed of 50% fumed silica and 50% carbon black; the flame retardant filler is zinc borate; the additives include: 8 parts by weight of aluminum powder, 22 parts by weight of copper powder, 2 parts by weight of magnesium oxide, sodium sulfate 4 parts by weight, 4 parts by weight of titanium dioxide.

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PUM

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Abstract

The invention discloses a heat-conducting silica gel material for computers, which comprises 100 parts by weight of methyl vinyl silicone rubber, 5-15 parts by weight of aluminum powder, 10-15 parts by weight of light-curing adhesive, 10-20 parts by weight of silane coupling agent, 10-20 parts by weight of vinyl trimethoxysilane, 15-20 parts by weight of divinyl silicone oil. The thermally conductive silica gel provided by this application has excellent compressive and tensile properties, and heat-resistant agents, flame retardants and additives are added to it. The heat-resistant agent improves the anti-aging ability of thermally conductive silica gel, and the flame retardant improves the flame retardancy of thermally conductive silica gel. Performance, additives improve the strength and thermal conductivity of thermal silica gel. In addition, hollow glass microspheres are added to reduce the density of silica gel.

Description

technical field [0001] The invention relates to the technical field of heat-conducting silica gel, in particular to a heat-conducting silica gel material for computers. Background technique [0002] With the development of microelectronics technology, electronic components are becoming thinner, lighter, smaller, and more multifunctional, and the assembly density of components is getting higher and higher. The heat dissipation of heating elements has become a prominent problem. If the accumulated heat cannot be dissipated in time, it will lead to an increase in the operating temperature of the components, which will directly affect the life and reliability of various high-precision equipment. Therefore, in order to better reduce the thermal resistance of the device and improve the overall heat transfer capability, it is necessary to use a thermal interface material between the heat transfer component and the heat dissipation component. Thermally conductive silicone material ...

Claims

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Application Information

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IPC IPC(8): C08L83/07C08L83/04C08K13/04C08K7/28C08K3/08C08K5/5425C08K3/36C08K3/04C08K3/22C08K3/30C09K5/14
CPCC08L83/04C08K2003/0812C08K2003/085C08K2003/222C08K2003/2224C08K2003/2227C08K2003/2241C08K2003/3045C08K2201/003C08L2201/02C08L2201/08C08L2203/20C08L2205/025C09K5/14C08K13/04C08K7/28C08K3/08C08K5/5425C08K3/36C08K3/04C08K3/22C08K3/30
Inventor 黄永
Owner 四川兴龙腾科技有限公司
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