Light emitting diode epitaxial wafer and preparation method thereof

A technology of light-emitting diodes and manufacturing methods, which is applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve the problems of limited promotion effect, achieve the effect of increasing the number of holes, improving luminous efficiency, and ensuring the confinement effect

Active Publication Date: 2018-04-06
HC SEMITEK ZHEJIANG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

If the gallium nitride quantum barrier layer closest to the electron blocking layer adopts the structure of the above-mentioned improved electron blocking layer, and also includes the first sublayer, the second sublayer and the third sublayer stacked in sequence, then the first sublayer is in While blocking the injection of electrons into the P-type gallium nitride layer, it will also block the injection of holes into the multi-quantum well layer for radiative recombination and light emission with electrons, while the second sublayer and the third sublayer can inject holes into the indium gallium nitrogen quantum well The promotion effect of the InGaN quantum well layer is limited, so the number of holes injected into the InGaN quantum well layer needs to be improved

Method used

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  • Light emitting diode epitaxial wafer and preparation method thereof
  • Light emitting diode epitaxial wafer and preparation method thereof
  • Light emitting diode epitaxial wafer and preparation method thereof

Examples

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Embodiment 1

[0032] An embodiment of the present invention provides a light emitting diode epitaxial wafer, see figure 1 , the light-emitting diode epitaxial wafer includes a substrate 1 and a buffer layer 2, an undoped gallium nitride layer 3, an N-type gallium nitride layer 4, a multi-quantum well layer 5, and an electron blocking layer 6 sequentially stacked on the substrate 1 and P-type GaN layer 7 .

[0033] In this example, see figure 2 The multi-quantum well layer 5 includes a plurality of first sublayers 50 stacked in sequence, and each first sublayer 50 includes a quantum well layer 51 and a quantum barrier layer 52 stacked on the quantum well layer 51 . Each quantum well layer 51 is an indium gallium nitride layer, and each quantum barrier layer 52 in the multi-quantum well layer 5 except the quantum barrier layer 52 closest to the electron blocking layer 6 is a gallium nitride layer. see image 3 , the quantum barrier layer 52 closest to the electron blocking layer 6 in the ...

Embodiment 2

[0050] An embodiment of the present invention provides a method for manufacturing a light-emitting diode epitaxial wafer, which is suitable for manufacturing the light-emitting diode epitaxial wafer provided in Embodiment 1, see Figure 4 , the manufacturing method includes:

[0051] Step 201: Provide a substrate.

[0052] Step 202: sequentially growing a buffer layer, an undoped GaN layer, an N-type GaN layer, a multi-quantum well layer, an electron blocking layer and a P-type GaN layer on the substrate.

[0053] In this embodiment, the multi-quantum well layer includes a plurality of first sublayers stacked in sequence, each first sublayer includes a quantum well layer and a quantum barrier layer stacked on the quantum well layer, and each quantum well layer is InGaN layer, each quantum barrier layer in the multi-quantum well layer except the quantum barrier layer closest to the electron blocking layer is a gallium nitride layer, and the quantum barrier layer closest to the...

Embodiment 3

[0073] An embodiment of the present invention provides a method for manufacturing a light-emitting diode epitaxial wafer, and the manufacturing method provided in this embodiment is a specific realization of the manufacturing method provided in Embodiment 2. In this embodiment, Veeco K465i or C4 Metal Organic Chemical Vapor Deposition (English: Metal Organic Chemical Vapor Deposition, abbreviated: MOCVD) equipment is used to realize the manufacture of LED epitaxial wafers. Using high-purity hydrogen (H 2 ) or high-purity nitrogen (N 2 ) or high purity H 2 and high purity N 2 The mixed gas as the carrier gas, high-purity NH 3 As nitrogen source, trimethylgallium (TMGa) and triethylgallium (TEGa) as gallium source, trimethylindium (TMIn) as indium source, trimethylaluminum (TMAl) as aluminum source, silane (SiH4) as N-type dopant, magnesium dicene (CP 2 Mg) as a P-type dopant. The pressure of the reaction chamber is controlled at 100torr~600torr.

[0074] Specifically, se...

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Abstract

The invention discloses a light emitting diode epitaxial wafer and a preparation method thereof, which belong to the technical field of semiconductors. The epitaxial wafer comprises a substrate, a buffer layer, an un-doped GaN layer, an N-type GaN layer, multiple quantum well layers, an electron barrier layer and a P-type GaN layer, wherein the multiple quantum well layers comprise multiple firstsub layers; each first sub layer comprises a quantum well layer and a quantum barrier layer; the quantum barrier layer which is the closest to the electron barrier layer comprises multiple second sublayers and a third sub layer; each second sub layer comprises a fourth sub layer, a fifth sub layer and a sixth sub layer; each fourth sub layer is an AlGaN layer; each fifth sub layer is a GaN layerwith Mg and In doped at the same time; the In doping position in each fifth sub layer is close to the sixth sub layer; each sixth sub layer is a GaN layer; the third sub layer is a GaN layer with Mg and In doped at the same time; and the Mg and In doping concentrations in the third sub layer are higher than those in each fifth sub layer. Hole injection can be increased, and the light emitting efficiency of the LED is improved.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a light-emitting diode epitaxial wafer and a manufacturing method thereof. Background technique [0002] Light Emitting Diode (English: Light Emitting Diode, referred to as: LED) is a semiconductor electronic component that can emit light. It has the characteristics of high efficiency, environmental protection and green. technology field. The chip is the core component of the LED, including epitaxial wafers and electrodes arranged on the epitaxial wafers. [0003] The existing LED epitaxial wafer includes a substrate and a buffer layer stacked on the substrate in sequence, an N-type gallium nitride layer, a multiple quantum well (English: Multiple Quantum Well, referred to as: MQW) layer, an electron blocking layer and a P-type nitride layer. gallium layer. Wherein, the multi-quantum well layer includes a plurality of sublayers stacked in sequence, and each sublayer inc...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/06H01L33/32H01L33/14H01L33/00
CPCH01L33/007H01L33/06H01L33/145H01L33/325
Inventor 从颖姚振胡加辉李鹏
Owner HC SEMITEK ZHEJIANG CO LTD
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