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Growth method of low-stress aluminum nitride crystal

A growth method, aluminum nitride technology, applied in the direction of crystal growth, single crystal growth, single crystal growth, etc., can solve the problems of many cracks, poor crystal quality at the interface of the substrate deposition layer, large crystal stress, etc., to reduce the crystal internal Stress, reduce substrate decomposition failure, increase the effect of nitrogen partial pressure

Active Publication Date: 2018-04-13
BEIJING HUAJINCHUANGWEI ELECTRONICS CO LTD
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Problems solved by technology

[0005] Aiming at the problems existing in the prior art, the object of the present invention is to provide a method for growing low-stress aluminum nitride crystals, which adopts a series of variable temperature and variable pressure growth processes, using different pressures and temperatures in the early, middle and late stages, and the last two The second temperature rise overcomes the problems of substrate decomposition during the growth of heterogeneous substrates, poor crystal quality at the interface of the substrate deposition layer, large internal stress of the crystal, and many cracks

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  • Growth method of low-stress aluminum nitride crystal

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[0024] The present invention will now be described more fully with reference to the accompanying drawings, in which exemplary embodiments of the invention are shown. This invention may, however, be embodied in many different forms and should not be construed as limited to the exemplary embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art.

[0025] Such as figure 1 As shown, the method of growing AlN crystals on heterogeneous substrates by the sublimation method can grow large-sized AlN crystals using large-diameter heterogeneous substrates. However, due to the lattice mismatch and thermal mismatch between the substrate seeds The crystal anisotropy caused by uneven deposition and uneven deposition, the present invention adjusts the radial temperature gradient by using a heating cylinder with non-uniform thickness, so as to precisel...

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Abstract

The invention discloses a growth method of a low-stress aluminum nitride crystal. According to the growth method, rapid two-dimensional mode growth of an AIN (Aluminum Nitride) crystal is achieved ina temperature and pressure variable mode, the stress of a single aluminum nitride crystal is reduced, and the single aluminum nitride crystal which has no crack on a growth surface and has naturally grown steps is grown. According to the growth method, a temperature control process and a mode that the temperate and the pressure of a specific temperature interval are varied in the growth process are adopted, the atom nucleation rate is reduced because of high pressure and low temperatures at a former stage, the primary nucleation tidiness is improved, and substrate decomposition failure is inhibited; at a middle growth stage, the pressure is reduced, so that the growth velocity is increased, and substrate decomposition is retarded; at a later stage, the temperature and the pressure are increased, nitrogen source supply is increased, a three-dimension island growth mode is avoided, the phenomena of non-uniform deposition and relatively large stress are reduced, secondary temperature increasing is implemented after cooling, the stress inside the crystal is reduced, cracks on the surface of the crystal is healed, a silicon carbide substrate is decomposed, and thus a self-striped high-quality single aluminum nitride crystal is grown.

Description

technical field [0001] The invention relates to the field of aluminum nitride single crystal preparation, in particular to a method for growing a low-stress aluminum nitride crystal. Background technique [0002] AlN crystal is an important wide bandgap (6.2eV) semiconductor material with high thermal conductivity (3.2W.cm -1 K -1 ), high resistivity and high surface acoustic velocity (5600-6000m / s) and other excellent physical properties, it is widely used in lasers, high-power electronic devices, optoelectronic devices and surface acoustic wave devices. At present, the physical vapor transport method (PVT) is recognized as an effective way to prepare large-sized aluminum nitride single crystals, and the method of preparing large single crystals is easier to use than self-nucleation growth by using a seed crystal bottom. [0003] The method of growing AlN crystals on heterogeneous substrates by the sublimation method, using large-diameter heterogeneous substrates can grow...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C30B29/40C30B23/00
CPCC30B23/002C30B29/403
Inventor 杨丽雯程章勇刘欣宇
Owner BEIJING HUAJINCHUANGWEI ELECTRONICS CO LTD
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