Supercharge Your Innovation With Domain-Expert AI Agents!

Single-board double-channel product testing and yield analysis system and method thereof

An analysis system and dual-channel technology, applied in the system field, can solve problems such as inaccurate formulation of yield control lines, high test costs, cost losses, etc., to facilitate analysis and problem handling, and improve test efficiency

Active Publication Date: 2018-04-13
CHIPSEA TECH SHENZHEN CO LTD
View PDF6 Cites 11 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] At present, the existing single-board mass-production test device cannot perform integrated tests on multiple analog indicators such as voltage and current, clock frequency, and pull-up and pull-down resistance. The flexibility is poor and the investment is high. The subsequent yield analysis brings difficulties, and there is no contact resistance detection, voltage and current semaphore test, ADC test and power supply voltage generation are all independent, and can only be applied to a single type of chip test, and tests of different types of projects It is necessary to re-develop the test platform, which has poor versatility and cannot quickly develop new test devices. The external signal line impedance, contact and other problems of the external ADC input signal lead to unreliable data, heavy repetitive workload, and chip failure due to DC characteristics. The testing equipment does not have a complete testing method and cannot perform yield analysis at the same time. Due to problems such as false contact between the chip and the handler, the test results will be misjudged, which will cause cost losses. In order to solve the yield problem, the test engineer It takes a lot of time to analyze the problem, and the whole process requires human participation. A lot of repetitive work increases the cost of manpower, material and time resources. Large internal friction leads to high testing costs, and subsequent maintainability becomes more difficult. Traditional yield analysis The method is restricted by actual conditions, and only analyzes and judges a single batch of chip products. In the case of large batch changes, the formulation of yield control lines is not accurate; due to the influence of traditional development ideas, there is a lack of highly integrated testing and testing. Yield analysis device restricts the efficiency of FT mass production test

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Single-board double-channel product testing and yield analysis system and method thereof
  • Single-board double-channel product testing and yield analysis system and method thereof
  • Single-board double-channel product testing and yield analysis system and method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0046] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0047] figure 1 , figure 2 As shown, it is a single-board dual-channel production test and yield analysis system realized by the present invention, which is characterized in that the system can provide necessary means for batch automation and multi-simulation parameter index testing of chips in the FT mass production stage, and multi-index The test method is integrated in a system for testing and yield processing, including contact resistance detection, which greatly improves the test efficiency, and performs preprocessing and display according to related issues, and stores the tested chip data i...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a single-board double-channel product testing and yield analysis system which comprises the components of a man-machine interface processing module, a contact resistance testing module, a mobile data storage module, a hardware updating module, a handler control module, a power control and voltage calibrating module, an analog index testing module, a yield analysis module and an LCD display module, wherein the man-machine interface processing module, the contact resistance testing module, the mobile data storage module, the hardware updating module, the handler control module, the power control and voltage calibrating module, the analog index testing module and the yield analysis module are integrated in an embedded microprocessor. The single-board double-channel product testing and yield analysis system have advantages of reducing testing cost, realizing a product testing requirement, automatically making a yield control line according to multiple batches of testing result, improving testing accuracy, reducing data inaccuracy caused by a contact problem, and greatly improving efficiency.

Description

technical field [0001] The invention belongs to the technical field of testing, and in particular relates to a system and a method for chip simulation performance testing, data statistics and analysis, and client programming. Background technique [0002] At present, the existing single-board mass-production test device cannot perform integrated tests on multiple analog indicators such as voltage and current, clock frequency, and pull-up and pull-down resistance. The flexibility is poor and the investment is high. The subsequent yield analysis brings difficulties, and there is no contact resistance detection, voltage and current semaphore test, ADC test and power supply voltage generation are all independent, and can only be applied to a single type of chip test, and tests of different types of projects It is necessary to re-develop the test platform, which has poor versatility and cannot quickly develop new test devices. The external signal line impedance, contact and other...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): G01R31/28
CPCG01R31/2834
Inventor 庞新洁
Owner CHIPSEA TECH SHENZHEN CO LTD
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More