Multilayer composite protective film with high light transmittance and preparation method of multilayer composite protective film

Abstract

The invention relates to the technical field of package protection of integrated circuits, in particular to a multilayer composite protective film with high light transmittance and a preparation method of the multilayer composite protective film. The multilayer composite protective film with high light transmittance comprises a wear-resistant outer layer, a first substrate layer, an antireflectioncoating, an adhesive layer, a second substrate layer, a protective glue coating and a glue layer protective film layer which are distributed in sequence. The multilayer composite protective film withhigh light transmittance has the beneficial effects that flexibility and stiffness are excellent, different kinds of slitting, die cutting and the like are facilitated, and the film is stuck to various electronic product materials for protection conveniently; the protective film comprises a UV-curable optical abrasion-resistant outer layer on the non-stick surface, and excellent anti-scratch andanti-smudging effects are achieved in processes of product processing and protection; the antireflection layer material is applied between phase composite substrate layers, and the overall light transmittance is higher than 92% after addition of the antireflection layer material; the protective film is coated with a heat-curable polymer protective glue coating, the Tg (glass transition temperature) of the protective glue coating is subzero 35-subzero 65 DEG C, and weather resistance is excellent.

Description

technical field [0001] The invention relates to the technical field of integrated circuit package protection, in particular to a multilayer composite high light transmittance protective film and a manufacturing method thereof. Background technique [0002] With the development of electronic product technology, especially the continuous improvement of the processing technology of high-end electronic product screens, semiconductors, and FPC / PCB circuit boards, the requirements for surface packaging protection and process processing protection have also been continuously improved, especially for the flexibility of its protective materials. Performance, stiffness, weather resistance, cleanliness and stability requirements are continuously upgraded. However, the application of traditional protective films, such as PE protective film, PP protective film, PVC protective film and single-layer PET protective film, has certain limitations and singleness. Therefore, a multi-functional ...

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Problems solved by technology

[0005] In the above-mentioned prior art, there are mainly the following disadvantages: (1) the protective film product invented by the prior art has poor flexibility and stiffness, and has a single application field; (2) the protective film product invented by the prior art is for making corresponding Protective scratch-resistant design, although it achieves a certain protective effect during the application process, the traces or dirt left by the possible damage to the protective surface will cause secondary pollution to the protected material; (3) the protective film invented by the prior art The light transmittance of the product is greatly reduced after applying various film glues; due to the different requirements for the glue layer applied in a single application, the weather resistance (high and low temperature resistance, high temperature and pressure) is poor

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