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Material high-temperature thermophysical parameter rapid measurement method

A technology of physical parameters and measurement methods, applied in the direction of material thermal conductivity, material thermal development, etc., can solve the problem of only one-dimensional measurement of a certain thermal physical parameter, poor method versatility, complicated control, etc., to achieve method versatility Good, low cost, large measurement range effect

Active Publication Date: 2018-05-18
CALCULATION AERODYNAMICS INST CHINA AERODYNAMICS RES & DEV CENT
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, when measuring the thermal conductivity, specific heat capacity or thermal diffusivity that changes with temperature, most measurement methods need to heat the sample to the predetermined temperature range every time a parameter of a certain temperature is measured, which has problems such as long cycle, complicated control and high cost. ; In addition, most methods still have problems such as only being able to measure one-dimensional problems or only being suitable for measuring a certain thermal physical parameter, and the generality of the method is poor; at the same time, since the sensor usually needs to be in contact with the tested object, the thermal physical property measurement range Will be limited by the high temperature performance of the sensor

Method used

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Embodiment Construction

[0031] Below in conjunction with accompanying drawing and through the specific embodiment of material high-temperature thermophysical parameter measurement, the present invention is described in further detail, following embodiment is descriptive only, non-limitative, can not limit the protection scope of the present invention with this.

[0032] Carry out the implementation of specific case according to technical scheme of the present invention and step, as follows:

[0033] The bottom of the material to be tested is heated by constant uniform heat flow Q=1e+5W / m 2 , the rest of the surface is adiabatic surface, the ultrasonic probe is placed on the upper end surface, and the pulsed ultrasonic wave is excited by vertical incidence. Based on the measurement of the change of the echo propagation time of the bottom surface, the thermal conductivity and heat capacity of the material are inverted by solving the thermal / acoustic coupling inverse problem. Or thermal diffusivity and ...

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Abstract

The invention discloses a material high-temperature thermophysical parameter rapid measurement method which comprises the following steps of according to the material thermophysical parameter-medium temperature-ultrasonic propagation characteristic, adopting an ultrasonic pulse-echo method to acquire an ultrasonic propagation time under the condition of transient heat transfer, inversing materialparameters in a heat transfer equation through the ultrasonic propagation characteristic, and rapidly measuring the thermophysical parameter of a material along with temperature change without loss and contact. By measuring for one time only, the method is capable of acquiring various material thermophysical parameters such as thermal conductivity, specific heat capacity or thermal diffusivity atdifferent temperatures from the room temperature to 400 DEG C, for example, when the temperature of the heating surface of a tested piece is raised to a preset temperature such as 400 DEG C, and has the outstanding advantages of rapid measurement speed, low cost, good universality, large measurement range and the like.

Description

technical field [0001] The invention relates to the field of ultrasonic detection, in particular to a rapid measurement method for high-temperature thermal physical property parameters of materials. Background technique [0002] Thermophysical parameters such as thermal conductivity, specific heat capacity, or thermal diffusivity are important characteristic parameters of materials. They are not only key parameters to measure whether materials can adapt to specific thermal process requirements, but also the basis for basic research and engineering design of specific thermal processes. data. The rapid and accurate measurement of thermal physical parameters of materials has obvious scientific significance and important engineering application value in high-tech fields such as aerospace, new materials, microelectronics, and industrial fields such as construction, chemical industry, biology, medicine, metallurgy, and electric power. [0003] The steady-state method and the unst...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01N25/18G01N25/20
CPCG01N25/18G01N25/20
Inventor 魏东石友安李伟斌肖光明代光月刘深深杜雁霞桂业伟
Owner CALCULATION AERODYNAMICS INST CHINA AERODYNAMICS RES & DEV CENT
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