Gold alloy composite bond wire having gold coating layer and manufacturing method thereof

A technology of a gold coating layer and a manufacturing method, which is applied in the field of gold alloy composite bonding wire and its manufacturing, can solve the problems such as hindering the application and development of gold bonding wire, low tensile strength of gold bonding wire, unfavorable for enterprises to improve competitiveness, etc. The effect of improving the anti-oxidation and anti-sulfur properties, improving the anti-oxidation and anti-sulfur properties, and improving the workability of the welding wire

Inactive Publication Date: 2018-05-29
NICHE TECH KAISER SHANTOU
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, as the international gold price continues to rise, the price of gold bonding wire has also risen all the way, resulting in high cost of end products, which is not conducive to enterprises to improve their competitiveness
In addition, the tensile strength of gold bonding wire is low (for example, the maximum tensile strength of gold bonding wire with a diameter of 20 microns is less than 5 gf after welding), and the elongation is not easy to control
The above two factors have become the bottleneck hindering the application and development of gold bonding wire

Method used

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  • Gold alloy composite bond wire having gold coating layer and manufacturing method thereof

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Effect test

Embodiment 1

[0034] The gold alloy composite bonding wire with a gold cladding layer of the present embodiment comprises a core wire and a gold cladding layer coated on the outside of the core wire; the core wire contains Ag 35%, Pd 3%, In 1%, by weight, Ca 50 ppm, Be 50 ppm, and the balance is gold; the thickness of the gold coating layer is 40nm.

[0035] In this embodiment, the manufacturing method of the gold alloy composite bonding wire having a gold coating layer comprises the following steps:

[0036] (1) Melting and casting: Ag, Pd, In, Ca and Be are added to the gold raw material in proportion, and after vacuum melting and directional continuous casting process, a core wire with a diameter of 8 mm is obtained;

[0037] (2) Wire drawing: drawing the core wire obtained in step (1) to obtain a bonding wire core wire with a diameter of 100um;

[0038] In this step (2), during the wire drawing process, the wire is subjected to intermediate annealing several times, and N 2 As the anne...

Embodiment 2

[0052] The gold alloy composite bonding wire with a gold cladding layer of the present embodiment comprises a core wire and a gold cladding layer coated on the outside of the core wire; the core wire contains 25% by weight of Ag, 5% of Pd, 0.6% of In, Ca 20 ppm, the balance is gold; the thickness of the gold coating layer is 60nm.

[0053] In this embodiment, the manufacturing method of the gold alloy composite bonding wire having a gold coating layer comprises the following steps:

[0054] (1) Melting and casting: Ag, Pd, In and Ca are added to the gold raw material in proportion, and after vacuum melting and directional continuous casting process, a core wire with a diameter of 6 mm is obtained;

[0055] (2) Wire drawing: drawing the core wire obtained in step (1) to obtain a bonding wire core wire with a diameter of 80um;

[0056] In this step (2), during the wire drawing process, the wire is subjected to intermediate annealing several times, and N 2 As the annealing atmo...

Embodiment 3

[0070] The gold alloy composite bonding wire with a gold cladding layer of the present embodiment includes a core wire and a gold cladding layer coated on the outside of the core wire; the core wire contains 49% by weight of Ag, 1% of Pd, and In 2 %, Ca 100 ppm, Be 10 ppm, and the balance is gold; the thickness of the gold cladding layer is 80nm.

[0071] In this embodiment, the manufacturing method of the gold alloy composite bonding wire having a gold coating layer comprises the following steps:

[0072] (1) Melting and casting: Ag, Pd, In, Ca and Be are added to the gold raw material in proportion, and after vacuum melting and directional continuous casting process, a core wire with a diameter of 8 mm is obtained;

[0073] (2) Wire drawing: drawing the core wire obtained in step (1) to obtain a bonding wire core wire with a diameter of 250um;

[0074] In this step (2), during the wire drawing process, the wire is subjected to intermediate annealing several times, and N 2 ...

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Abstract

Provided in the invention is a gold alloy composite bond wire having a gold coating layer. The gold alloy composite bond wire comprises a core wire and a gold coating layer coating the outside of thecore wire. The core wire includes, by weight, 25 to 49% of Ag, 0.2 to 0.5% of Pd, 0.5 to 2% of In, 2 to 200 ppm of a micro adding element, and the balance being gold. The micro adding element is one of or combination of Ca and Be. The thickness of the gold coating layer is 20 to 200 nm. In addition, the invention also provides a manufacturing method of the gold alloy composite bond wire having a gold coating layer. According to the gold alloy composite bond wire, the anti-oxidation and anti-vulcanization performances of the wire rod are improved effectively; the secondary-welding tensile forceand the primary-welding tensile force are strengthened; the welding wire operationality of the gold alloy is enhanced effectively; the adhesion property among the wire rod, the chip and the substrateis enhanced; the trust performance is improved; and the cost is lowered.

Description

technical field [0001] The invention relates to a bonding wire for IC and LED packaging, in particular to a gold alloy composite bonding wire with a gold coating layer and a manufacturing method thereof. Background technique [0002] Bonding wire (bonding wire, also known as bonding wire) is the main connection method for connecting a chip to an external packaging substrate (substrate) and / or multilayer circuit board (PCB). [0003] The traditional gold bonding wire made of pure gold has excellent chemical stability and electrical and thermal conductivity, so it is widely used as the inner lead of IC. However, with the continuous rise of international gold prices, the price of gold bonding wires has also been rising, resulting in high cost of end products, which is not conducive to enterprises to improve their competitiveness. In addition, the tensile strength of gold bonding wire is low (for example, the maximum tensile strength of gold bonding wire with a diameter of 20 m...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/49H01L21/48C22C5/02C22F1/14C25D3/48
CPCC22C5/02C22F1/14C25D3/48H01L21/4889H01L23/49
Inventor 周振基周博轩于锋波彭政展麦宏全
Owner NICHE TECH KAISER SHANTOU
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