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A kind of preparation method of adhesion promoter for addition type silicone encapsulation glue

An adhesion promoter and silicone technology, which is applied in the field of preparation of an adhesion promoter for addition type silicone encapsulant, can solve the problems of poor compatibility of the encapsulant, environmental pollution, complicated preparation process and the like, and achieve compatibility Good, easy to obtain raw materials, good application prospects

Active Publication Date: 2021-01-05
FOSHAN XINXIANGXING CHEM
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the adhesion promoters currently on the market generally have disadvantages such as cumbersome preparation process, organic solvents are often used in the preparation process, causing certain pollution to the environment, and poor compatibility with encapsulation adhesives.

Method used

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  • A kind of preparation method of adhesion promoter for addition type silicone encapsulation glue
  • A kind of preparation method of adhesion promoter for addition type silicone encapsulation glue
  • A kind of preparation method of adhesion promoter for addition type silicone encapsulation glue

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0020] In this example, the preparation method of the adhesion promoter is: add 104.16 g of tetraethyl orthosilicate, 12.5 g of hydroxyl-terminated polysiloxane with a relative molecular mass of 500, and 22.4 g of hexamethyldisiloxane into the In a 500mL three-neck flask equipped with a thermometer, mechanical stirring and condensing reflux tube, stir well at room temperature, add 0.54g hydrochloric acid and 54g deionized water, react at 20°C for 7h, then add 94.53g 3-(2,3-epoxy Propoxy)propyltrimethoxysilane, 24.83g 3-methacryloxypropyltrimethoxysilane and 18.2g hexamethyldisiloxane, react at 90°C for 2h, and finally remove low boilers , to prepare Adhesion Promoter 1.

[0021] The method for preparing the addition-type silicone encapsulant sample is as follows: 100 parts by mass of vinyl methyl silicone resin with a vinyl content of 3.2 wt%, 80 parts by mass of vinyl silicone oil with a viscosity of 5000mPa·s, 11 parts by mass of active hydrogen Hydrogen-containing silicone...

Embodiment 2

[0023] In this example, the preparation method of the adhesion promoter is: add 76.11g of methyl orthosilicate, 10g of hydroxyl-terminated polysiloxane with a relative molecular weight of 1000 and 20.42g of trimethylmethoxysilane into a A 500mL three-necked flask with a thermometer, a mechanical stirrer and a condensing reflux tube, stirred evenly at room temperature, added 0.9g of acetic acid and 18g of deionized water, reacted at 40°C for 3h, then added 55.08g of 3-(2,3-epoxypropylene Oxy)propylmethyldimethoxysilane, 58.08g 3-methacryloxypropylmethyldimethoxysilane and 14.05g trimethylmethoxysilane were reacted at 80°C for 4h, and finally Removal of low boilers yields Adhesion Promoter 2.

[0024] The method for preparing the addition-type silicone encapsulant sample in this example is basically the same as that in Example 1, except that the adhesion promoter 1 in Example 1 is changed to adhesion promoter 2. The properties of the samples are shown in Table 1 and Table 2.

Embodiment 3

[0026] In this example, the preparation method of the adhesion promoter is: add 89.15g of methyltriethoxysilane, 15g of hydroxyl-terminated polysiloxane with a relative molecular mass of 3000 and 12.32g of trimethylmethoxysilane into the In a 500mL three-neck flask equipped with a thermometer, mechanical stirring and condensing reflux tube, stir well at room temperature, add 0.45g of sulfuric acid and 27g of deionized water, react at 55°C for 2h, then add 41.76g of 3-(2,3-epoxy Propoxy)propyltriethoxysilane, 101.65g 3-methacryloxypropyltriethoxysilane and 11.33g trimethylmethoxysilane were reacted at 70°C for 3h, and finally the low Boiler, obtained adhesion promoter 3.

[0027] The method for preparing the addition-type silicone encapsulating adhesive sample in this example is basically the same as that in Example 1, except that the adhesion promoter 1 in Example 1 is changed to adhesion promoter 3. The properties of the samples are shown in Table 1 and Table 2.

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Abstract

The invention discloses a preparation method for an adhesion promoter used for an addition type organosilicon packaging adhesive. The method comprises the following steps: uniformly mixing silane, hydroxyl-terminated polysiloxane and an end sealing agent under stirring at a room temperature, adding a catalyst and deionized water, carrying out a reaction at 20 to 80 DEG C for 1 to 7 h, then addingepoxy silane, ester based silane and an end sealing agent, carrying out a reaction at 50 to 90 DEG C for 1 to 8 h, and removing low-boiling-point substances so as to obtain the adhesion promoter. Thepreparation method provided by the invention is simple, can prevent side reactions like ring opening of epoxy groups in a one-step reaction from generation, is environment-friendly and facilitates realizing large-scale production. The adhesion promoter prepared by using the preparation method provided by the invention has good compatibility with the addition type organosilicon packaging adhesive,and has significant viscosifying effect.

Description

technical field [0001] The invention relates to the technical field of silicone packaging materials, in particular to a preparation method of an adhesion promoter for addition-type silicone packaging glue. Background technique [0002] Addition-type silicone encapsulants have many excellent properties and are widely used, but after curing, most of their surfaces are non-polar organic groups, so they have poor adhesion to light-emitting diode (LED) substrates. After encapsulation, small molecular substances such as moisture and sulfur dioxide in the air can easily enter the interior of the LED device through the gap between the encapsulant and the substrate, resulting in encapsulation failure, which seriously hinders its further promotion and application. [0003] At present, there are three main methods to improve the bonding performance of addition-type silicone encapsulants and substrates: one is to treat the surface of the substrate to be bonded; the other is to change th...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L83/07C08L83/05C08L83/06C08G77/38
CPCC08G77/38C08L83/04C08L2201/10C08L2203/206C08L2205/025C08L2205/035C08L83/06
Inventor 潘科学梁广耀梁广伟吴明华柏凤登曾幸荣
Owner FOSHAN XINXIANGXING CHEM
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