Graphene-carbon nanometer tube film-based heat-conducting gasket and preparation method thereof

Abstract

The invention provides a graphene-carbon nanometer tube film-based heat-conducting gasket and a preparation method thereof. The heat-conducting gasket comprises a substrate and a composite graphene-carbon nanometer tube film arranged on the substrate, wherein the composite graphene-carbon nanometer tube film is obtained by overlapping at least two layers of single-layer graphene-carbon nanometer tube films; a heat-conducting glue layer is arranged between every two single-layer graphene-carbon nanometer tube films. The heat-conducting gasket has the characteristics that the heat conduction effect is good; the stretch and compression deformation is great; the weight is light.

Description

technical field [0001] The invention belongs to the field of heat-conducting materials, and relates to a heat-conducting gasket, in particular to a graphene-carbon nanotube film-based heat-conducting gasket and a preparation method thereof. Background technique [0002] After decades of development, today's thermal interface materials have gradually developed from low-end products such as thermal oil, thermal grease, and thermal silicone cloth to high-end products such as thermal pads, phase change materials, thermal gels, and liquid metals. The technology has also been gradually improved, among which thermal pads have developed the fastest and are most widely used. [0003] The traditional thermal pads basically use silica gel or other polymer materials as the matrix material. By filling the thermal conductive powder, the composite material has a thermal conduction channel, so as to play the role of heat conduction of the material. The more powder filled, the greater the pa...

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Problems solved by technology

[0003] The traditional thermal pads basically use silica gel or other polymer materials as the matrix material. By filling the thermal conductive powder, the composite material has a thermal conduction channel, so as to play the role of heat conduction of the material. The more powder filled, the greater the particle size. The more reasonable the diameter collocation, the more heat conduction channels, and the higher the thermal conductivity of the corresponding material. However, with more and more filling materials, the mechanical properties of the product, especially the tensile strength and compressibility, are greatly reduced, so it is used in many occasions. It is limited, and at the same time, the more powder is filled, the density of the material will also increase, which is obviously inconsistent with the current trend of pursuing light weight and user physical examination

At present, the thermal conductivity of thermal pads with polymer substrates on the market is generally below 5W / m K. As various industries such as electronic products gradually develop into higher integration, higher heat flux density, and smaller space , the existing heat conduction products are difficult to meet the demand, and thermal interface materials with higher thermal conductivity are needed to conduct the heat of the core heating components more quickly

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