Light emitting element, light emitting device, electronic device, display device, and illuminating device
A light-emitting element and light-emitting layer technology, which is applied in the field of lighting devices, machines, programs, products or compositions, can solve the problems of widening of the half-width of light emission and unfulfilled color purity, and achieve long service life, low power consumption, Good effect of luminous efficiency
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Embodiment approach 1
[0078] Metal halide perovskite materials are materials composed of organic materials and inorganic materials or composed of only inorganic materials, and have interesting characteristics such as exciton emission and high mobility of carriers (hereinafter, the material is referred to as are metal halide perovskite materials). In particular, a metal halide perovskite material forming a superlattice structure in which inorganic layers (also called perovskite layers) and organic layers are alternately stacked has a quantum well structure, and its exciton binding energy is very large, Excitons can thus exist stably. In addition, the metal halide perovskite material exhibits exciton emission with narrow half-width and small Stokes shift, and thus is expected to be applied to light-emitting devices. In addition, quantum dots of known metal halide perovskite materials also exhibit luminescence with a very narrow half-width and good color purity.
[0079] In addition, metal halide pe...
Embodiment approach 2
[0179] In this embodiment mode, a light-emitting device using the light-emitting element described in Embodiment Mode 1 will be described.
[0180] refer to Figure 4A and Figure 4B A light emitting device according to one embodiment of the present invention will be described. Figure 4A is the top view of the light emitting device, Figure 4B is along Figure 4A Cross-sectional views of A-B and C-D cut in. This light-emitting device includes a driver circuit unit (source line driver circuit) 601 , a pixel unit 602 , and a driver circuit unit (gate line driver circuit) 603 indicated by dotted lines as a unit for controlling light emission of the light-emitting element. In addition, reference numeral 604 is a sealing substrate, reference numeral 605 is a sealing material, and the inside surrounded by the sealing material 605 is a space 607 .
[0181] The lead wiring 608 is a wiring for transmitting signals input to the source line driver circuit 601 and the gate line driv...
Embodiment 1
[0253] In this example, the manufacturing method and characteristics of the light-emitting element 1 according to one embodiment of the present invention and the comparative light-emitting element 1 will be described in detail.
[0254] (Manufacturing method of light-emitting element 1)
[0255] First, the anode 101 is formed by forming indium tin oxide (ITSO) including silicon oxide on a glass substrate by a sputtering method. Its thickness is 70nm, and the electrode area is 2mm×2mm.
[0256] Next, as a pretreatment for forming a light-emitting element on the substrate, the surface of the substrate was washed with water, baked at 200° C. for 1 hour, and then subjected to UV ozone treatment for 370 seconds.
[0257]Then, the substrate was fixed to the substrate holder of the spin coater so that the surface on which the anode 101 was formed was facing upward, and the anode 101 was coated with poly(3,4-ethylenedioxythiophene) / poly(styrene Sulfonic acid) (PEDOT / PSS) solution (H...
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