Design and manufacture method of millimeter wave 3D coaxial transmission line

Abstract

The invention provides a millimeter wave 3D coaxial transmission line design and manufacturing method based on the LTCC technology. The LTCC technology is the multilayer wiring and stereoscopic interconnection technology and can realize sintering of 100 layers of ceramic wafers. The low-loss Ferro A6M ceramic material in the millimeter wave band is used as the wafer, the through holes of great collimation and morphology are processed on the single layer wafer by using the laser process, high-precision alignment is performed on multiple through holes by using the laser alignment technology, andmultiple single layer through holes filled with metal paste are interconnected by using a circular protection welding pad and superposed into long through holes of the required height. The peripherallong through holes are interconnected by using an annular protection welding pad, and the long through holes form a mesh structure through enclosing to act as an external conductor so as to constructthe 3D structure millimeter wave coaxial transmission line. The simulation result indicates that the novel high-reliability coaxial transmission line can work to 300 GHz.

Description

technical field

[0001] The invention relates to a method for designing and manufacturing a millimeter-wave 3D coaxial transmission line. Background technique

[0002] The miniaturization technology of millimeter-wave devices is one of the development trends of millimeter-wave technology, and the high-density integration of millimeter-wave devices in three-dimensional space is an effective way to achieve miniaturization. The integration of mmWave systems requires the use of transmission line structures to interconnect devices. However, when the operating frequency of electromagnetic waves increases to the millimeter-wave frequency band, millimeter-wave system integration requires high-precision processing and installation processes, which increases the cost and integration difficulty of millimeter-wave systems. The current design and processing technology of planar transmission lines cannot realize the three-dimensional integration of millimeter wave systems, so it is necess...

Examples

Embodiment 1

[0048] Embodiment 1: a 3D transmission line with an upper limit of operating frequency of 150 GHz and an impedance of 50 ohm.

[0049] Select the diameter of the central conductor post 1 to be 100 μm, the diameter of the protective pad 2 of the central conductor post to be 150 μm; the diameter of the cylindrical ground via post 4 to be 100 μm, and the distance from the center of the central conductor post 1 to be 480 μm, the inner diameter of the annular protective pad 3 is 760 μm, and the outer diameter is 960 μm; the relative dielectric constant of the Ferro A6M ceramic dielectric material used is 5.9, the single-layer height of the ceramic after sintering is 96 μm, and the number of layers of the ceramic used is 9 floors. The simulated two-port S-parameter curve is as follows image 3 shown.

Embodiment 2

[0050] Embodiment 2: a transmission line with an upper limit of operating frequency of 300 GHz and an impedance of 50 ohm. The diameter of the cylindrical grounding via column is 100 μm, the distance from the center of the central conductor column 1 is 700 μm, the inner diameter of the annular protection pad 3 is 625 μm, and the outer diameter is 775 μm; Ferro A6M ceramics are used The dielectric constant of the dielectric material is 5.9, the height of the sintered single-layer ceramic is 96 μm, and the number of layers of the ceramic used is 9. The simulated two-port S-parameter curve is as follows Figure 4 shown.

[0051] The present invention is superior to the prior art solutions in that: Ferro A6M material with lower millimeter wave loss is used as the substrate; laser alignment technology is used to ensure the positioning accuracy after stacking and sintering; laser drilling technology is used to obtain the desired accurate metal pass. The shape of the hole and the s...

technical field

[0001] The invention relates to a method for designing and manufacturing a millimeter-wave 3D coaxial transmission line. Background technique

[0002] The miniaturization technology of millimeter-wave devices is one of the development trends of millimeter-wave technology, and the high-density integration of millimeter-wave devices in three-dimensional space is an effective way to achieve miniaturization. The integration of mmWave systems requires the use of transmission line structures to interconnect devices. However, when the operating frequency of electromagnetic waves increases to the millimeter-wave frequency band, millimeter-wave system integration requires high-precision processing and installation processes, which increases the cost and integration difficulty of millimeter-wave systems. The current design and processing technology of planar transmission lines cannot realize the three-dimensional integration of millimeter wave systems, so it is necess...

Examples

Embodiment 1

[0048] Embodiment 1: a 3D transmission line with an upper limit of operating frequency of 150 GHz and an impedance of 50 ohm.

[0049] Select the diameter of the central conductor post 1 to be 100 μm, the diameter of the protective pad 2 of the central conductor post to be 150 μm; the diameter of the cylindrical ground via post 4 to be 100 μm, and the distance from the center of the central conductor post 1 to be 480 μm, the inner diameter of the annular protective pad 3 is 760 μm, and the outer diameter is 960 μm; the relative dielectric constant of the Ferro A6M ceramic dielectric material used is 5.9, the single-layer height of the ceramic after sintering is 96 μm, and the number of layers of the ceramic used is 9 floors. The simulated two-port S-parameter curve is as follows image 3 shown.

Embodiment 2

[0050] Embodiment 2: a transmission line with an upper limit of operating frequency of 300 GHz and an impedance of 50 ohm. The diameter of the cylindrical grounding via column is 100 μm, the distance from the center of the central conductor column 1 is 700 μm, the inner diameter of the annular protection pad 3 is 625 μm, and the outer diameter is 775 μm; Ferro A6M ceramics are used The dielectric constant of the dielectric material is 5.9, the height of the sintered single-layer ceramic is 96 μm, and the number of layers of the ceramic used is 9. The simulated two-port S-parameter curve is as follows Figure 4 shown.

[0051] The present invention is superior to the prior art solutions in that: Ferro A6M material with lower millimeter wave loss is used as the substrate; laser alignment technology is used to ensure the positioning accuracy after stacking and sintering; laser drilling technology is used to obtain the desired accurate metal pass. The shape of the hole and the s...

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