Single-side aluminum substrate for LED lamp and manufacturing process of single-side aluminum substrate

Abstract

The invention discloses a single-side aluminum substrate for an LED lamp and a manufacturing process of the single-side aluminum substrate and solves the problem that a manually-welded electronic component usually has long pins and cannot conveniently be welded to a soldering lug. According to the technical scheme, the single-side aluminum substrate is characterized in that an optical aluminum plate is provided with a plurality of first direct insertion holes allowing the pins of an electronic component to penetrate, a resin insulating layer and a circuit layer are provided with second directinsertion holes communicated with the first direct insertion holes, the first direct insertion holes and the second direct insertion holes form stepped holes, the first direct insertion holes are filled with resin protectors, one end faces, facing the resin insulating layer, of the resin protectors contacts with the resin insulating layer, and the resin protectors are provided with third direct insertion holes communicated with the second direct insertion holes. By the single-side aluminum substrate, short circuit between the direct insertion type electronic component and the aluminum substrate after direct insertion is avoided, and the welding between the direct insertion type electronic component and the aluminum substrate is facilitated.

Description

technical field [0001] The invention relates to the manufacture of aluminum substrates, in particular to a single-sided aluminum substrate for LED lamps and a manufacturing process thereof. Background technique [0002] Aluminum substrate is a metal-based copper-clad laminate with good heat dissipation function. It is often used in LED lighting products. The general single-sided aluminum substrate consists of three layers, which are circuit layer (copper foil), insulating layer and metal base layer. The side of the circuit layer is white for SMD electronic components; the side of the metal base layer shows the natural color of aluminum. Generally, the heat-conducting paste is applied and then contacted with the heat-conducting part to make the aluminum substrate have better heat dissipation. [0003] Such as figure 1 Shown is a common single-sided aluminum substrate, including a copper foil circuit layer 91, an insulating layer 92, and a metal-based heat dissipation layer 9...

AI Technical Summary

Problems solved by technology

[0003] like figure 1 Shown is a common single-sided aluminum substrate, including a copper foil circuit layer 91, an insulating layer 92, and a metal-based heat dissipation layer 93 arranged in sequence, wherein the copper foil circuit layer 91 is provided with a soldering piece 911 for electronic component mounting , the electronic components can be pasted on the soldering tab 911 by a placement machine, but some electronic components cannot be mounted on the soldering tab 911, and can only be manually soldered on the soldering tab 911, and the electronic components that are manually soldered usually have a long length It is very inconvenient to solder directly on the pad

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