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Soldering flux for soldering, preparation method of soldering flux and soldering paste

A flux and soldering technology, applied in welding equipment, welding media, manufacturing tools, etc., to achieve the effect of increasing the height of tin climbing

Inactive Publication Date: 2018-07-13
SHENZHEN BOSHIDA TIN SOLDERING PROD CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In order to not only meet the wettability requirements of the pads and the requirements for the tin climbing height of the QFN pins, but also avoid affecting the stability of the solder paste during storage due to excessive activity, the invention provides a flux for soldering

Method used

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  • Soldering flux for soldering, preparation method of soldering flux and soldering paste
  • Soldering flux for soldering, preparation method of soldering flux and soldering paste
  • Soldering flux for soldering, preparation method of soldering flux and soldering paste

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Embodiment Construction

[0021] A flux for soldering is composed of 45-50wt% resin, 8.0-10.0wt% active agent, 30-35wt% solvent, 4.0-5.0wt% antioxidant and 6.0-8.0wt% Resin flux composed of thixotropic agent, etc., is also composed of organic amine derivatives represented by compound 1, compound 2 or compound 3 by adding 0.5~5wt%:

[0022]

[0023] Compound 1 is monoisopropanolamine, Compound 2 is diisopropanolamine, Compound 3 is triisopropanolamine.

[0024] Preferably, the resin is a rosin-based resin.

[0025] Preferably, succinic acid, malic acid and methanesulfonic acid are also added.

[0026] A method for preparing flux for soldering. The organic amine derivatives and organic acids are pre-reacted in a container, and the reacted substance is put into an oven at 40°C for dehydration and drying. Finally, it is Sealed storage; in the process of preparing flux, amide products are added at the end. At this time, the reaction temperature of the flux system is low, and the amide is not easy to de...

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Abstract

The invention discloses a soldering flux for soldering. Organic amine and a derivative thereof are introduced into a soldering flux activator. During preparation of the soldering flux, organic amine and the derivative thereof perform a reversible chemical reaction with an organic acid. An amides substance with low activity is produced after cooling is performed. The amides substance is stable at alow temperature and cannot perform a chemical reaction with tin powder, so that a solder paste can be stably stored. During reflow soldering, the temperature rises, the amides substance is reversed to regenerate the organic acid, organic amine and the derivative thereof. The two substances are strong activators and can enhance the wettability of a bonding pad in a reflow soldering phase and solder wicking of such pins as a QFN.

Description

technical field [0001] The invention relates to the field of flux, in particular to a flux for soldering, a preparation method thereof and a solder paste. Background technique [0002] Solder paste is a whole new type of soldering material that emerged with surface mount technology (SMT). Solder paste is a complex system, a creamy mixture formed by mixing solder alloy powder, flux and other additives. Solder paste has a certain viscosity at room temperature, which can initially stick electronic components to a predetermined position. During the reflow soldering process, as the soldering temperature increases, the solvent and some additives volatilize, and the solder alloy melts and spreads on the pad, soldering the soldered components and the printed circuit board pad together to form a permanent connection. [0003] Solder alloy powder is made of molten solder alloy through high-pressure inert gas spray or ultrasonic atomization deposition process. The shape, particle si...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/36
CPCB23K35/3613B23K35/3615
Inventor 胡佳胜楚成云谭志阳
Owner SHENZHEN BOSHIDA TIN SOLDERING PROD CO LTD