A low-temperature sintered low dielectric constant ceramic substrate material and its preparation method

Abstract

The invention discloses a low-temperature sintered low dielectric constant ceramic substrate material and a preparation method thereof, wherein, according to the mass ratio, the components of the ceramic substrate material include: 10-18% of LBS glass, 82-90% of Li 2 SiO 3 ; According to the mass ratio, the composition of the LBS glass is: 20-26% Li 2 CO 3 , 36-45% B 2 o 3 , 10-18% SiO 2 , 1~10% CaCO 3 , 0~5% Na 2 CO 3 , and 0~5% Al 2 o 3 , the Li 2 SiO 3 The molar ratio of each component of ceramic powder is Li 2 O: SiO 2 =0.9~1.1:1. The ceramic substrate material provided by the invention has the characteristics of low dielectric constant and high strength, and at the same time, its sintering preparation temperature is low, which can well meet the performance requirements of the electronic packaging substrate material.

Description

technical field [0001] The invention belongs to the field of electronic information functional materials, and in particular relates to a low-temperature sintered ceramic substrate material with extremely low dielectric constant and high bending strength and a preparation method thereof. Background technique [0002] In recent years, the rapid development of the semiconductor industry has placed higher and higher requirements on electronic packaging, and multilayer substrate technology has emerged as the times require. The application of low-dielectric constant low-temperature co-fired ceramic (LTCC) multilayer substrate improves the signal transmission speed and wiring density, and can meet the requirements of VLSI high-density packaging. It is the key basic material of modern communication technology and is used in portable mobile phones. , TV satellite receivers, and military radars have very important applications, and are playing an incomparably important role in the min...

AI Technical Summary

Problems solved by technology

However, pure Al 2 o 3 The sintering temperature of ceramics is relatively high (1400°C-1500°C), so it cannot be directly co-fired with commonly used low-melting point metals such as Ag and Cu.

Therefore, in order to reduce the sintering temperature, the traditional method is used to incorporate low melting point oxide B 2 o 3 and V 2 o 5 , while the free B 2 o 3 and V 2 o 5 In the later casting process, it is easy to cause the viscosity of the slurry to be too large and unstable, which limits its practical application: another method is Al 2 o 3 -Crystalized glass, that is, doping a small amount of ceramics in the crystallized glass as a nucleating agent, the final performance of the product depends on the degree of crystallization of the sample

However, due to the large amount of crystallized glass required in this method, the cost is high, which greatly limits the development of glass-ceramic composite substrate materials.

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