The invention discloses a
power module packaging structure. According to the
chip, a non-linear conductive material
coating is arranged at the connecting part of the edge of each
metal bonding pad and a
chip substrate, and the connecting part of the edge of each
metal bonding pad and the
chip substrate is the joint of the
metal bonding pad, the chip substrate and an insulating encapsulating material, namely the three-
phase point. Through the arrangement of the non-linear conductive material
coating, the resistivity is high in a normal low field, and electric leakage is prevented; and when the local
electric field intensity is increased sharply (terminal at the three-phase junction), the resistivity is reduced sharply, the
electric field is uniformly dispersed, and the peak of the local
electric field is inhibited, so that the overall
dielectric strength and creepage distance of the module are improved. According to the technical scheme, the insulation reliability of the
power module under high-
voltage, high-frequency and high-temperature working conditions is remarkably improved, particularly,
partial discharge is restrained at a three-
phase point, the service life of the module is prolonged, and the production and maintenance cost is reduced.