Heat-conductive pressure-sensitive adhesive tape, and preparation method and application method thereof

A technology of pressure-sensitive adhesive tape and pressure-sensitive adhesive layer, which is applied in the direction of pressure-sensitive film/sheet, adhesive, epoxy resin glue, etc., can solve the problems such as the deterioration of the bonding strength of thermally conductive adhesives, and achieve good reworkability, wetting retention, and reduction The effect of manufacturing costs

Active Publication Date: 2018-07-31
SUZHOU ENBRIGHTECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The object of the present invention is to provide a heat-conducting pressure-sensitive adhesive tape and its preparation method an

Method used

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  • Heat-conductive pressure-sensitive adhesive tape, and preparation method and application method thereof
  • Heat-conductive pressure-sensitive adhesive tape, and preparation method and application method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] A method for preparing and using a heat-conducting pressure-sensitive adhesive tape, the mass percentage of each raw material is as follows:

[0027] Component

Proportion

Aluminum oxide

40％

solvent

20％

Modified Acrylic Resin

15％

Normal temperature curing agent

1％

Polyester polyol

15％

Adhesion promoter

1％

filler dispersant

2％

Filler coupling agent

1％

Closed Polyurethane Curing Agent

5％

[0028] First add aluminum oxide, solvent, filler dispersant, and filler coupling agent into the stirring tank, disperse at high speed for 3 minutes, then add the rest of the components into the stirring tank, and continue stirring for 40 minutes to prepare a heat-conducting pressure-sensitive adhesive; Use the heavy-release protective film as the coating substrate, coat the heat-conducting pressure-sensitive adhesive on it, dry it in a gradient oven at 50°C, attach the light-release...

Embodiment 2

[0031] A method for preparing and using a heat-conducting pressure-sensitive adhesive tape, the mass percentage of each raw material is as follows:

[0032] Component

Proportion

fumed silica

30％

solvent

25％

Modified Acrylic Resin

15％

Normal temperature curing agent

1％

epoxy resin

20％

Adhesion promoter

1％

filler dispersant

2％

Filler coupling agent

1％

Epoxy curing agent

5％

[0033] First add fumed silica, solvent, filler dispersant, and filler coupling agent into the stirring tank, disperse at high speed for 10 minutes, then add the rest of the components into the stirring tank, and continue stirring for 40 minutes to prepare a heat-conducting pressure-sensitive adhesive; Use the heavy-release protective film as the coating substrate, coat the heat-conducting pressure-sensitive adhesive on it, and after drying in a gradient oven at 50°C, attach the light-release protective ...

Embodiment 3

[0036] A method for preparing and using a heat-conducting pressure-sensitive adhesive tape, the mass percentage of each raw material is as follows:

[0037] Component

Proportion

Aluminum oxide

30％

solvent

25％

Modified Acrylic Resin

15％

Normal temperature curing agent

1％

UV curable resin

20％

Adhesion promoter

1％

filler dispersant

2％

Filler coupling agent

1％

light curing agent

5％

[0038] First add aluminum oxide, solvent, filler dispersant, and filler coupling agent into the stirring tank, disperse at high speed for 20 minutes, then add the rest of the components into the stirring tank, and continue stirring for 30 minutes to prepare a heat-conducting pressure-sensitive adhesive; The heavy-release protective film is used as the coating substrate, and the heat-conducting pressure-sensitive adhesive is coated on it. After drying in a gradient oven at 70°C, the light-release ...

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PUM

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Abstract

The invention relates to a heat-conductive pressure-sensitive adhesive tape. The heat-conductive pressure-sensitive adhesive tape comprises a heat-conductive pressure-sensitive adhesive layer, a lightrelease protective layer, and a heavy release protective layer; the heat-conductive pressure-sensitive adhesive layer is arranged on the heavy release protective layer. The initial viscosity of the heat-conductive pressure-sensitive adhesive tape is adjustable, so that excellent heavy industry performance is achieved; after bonding, subsequent solidification of heat-conductive adhesive can be realized, reduction of the bonding strength with time is not caused, and extra mechanical fastening buckle design by users of conventional heat conductive adhesive is not needed, so that client manufacturing cost is reduced.

Description

technical field [0001] The invention relates to the field of pressure-sensitive adhesive tape preparation, in particular to a heat-conducting pressure-sensitive adhesive tape, a preparation method and a use method thereof. Background technique [0002] Existing pressure-sensitive thermally conductive adhesives are widely used. During use, its cohesiveness will continue to decrease with heat and time. Thermally conductive adhesives are often used in electronic devices. During the use of electrical appliances, they are affected by gravity or motion acceleration, and there is a force between the components. During the use of customers, there is a risk of debonding. Once the thermal conductive adhesive is debonded, the thermal conduction between the interfaces will deteriorate rapidly, which may cause the device to burn out. For example, in liquid crystal displays, heat-conducting pressure-sensitive adhesives are often used to bond the LED light bar and heat dissipation parts....

Claims

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Application Information

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IPC IPC(8): C09J7/38C09J7/10C09J7/21C09J133/04C09J177/00C09J167/00C09J163/00C09J201/00C09J101/08C09J183/04C09J11/04C09J11/08
CPCC08K2003/2227C08L2205/025C08L2205/03C08L2205/18C09J7/10C09J7/21C09J7/38C09J7/385C09J11/04C09J11/08C09J101/08C09J133/04C09J163/00C09J167/00C09J177/00C09J183/04C09J201/00C09J2301/408C09J2301/412C09J2400/143C08L77/00C08K3/22C08L33/04C08K3/36C08L63/00C08L101/00C08L83/04C08L91/06
Inventor 雷贝宋丽萍
Owner SUZHOU ENBRIGHTECH
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