Method for preparing dense precursor ceramic temperature sensor

A technology of temperature sensors and precursors, applied in thermometers, ceramic molding machines, thermometers with electric/magnetic elements that are directly sensitive to heat, etc., can solve the problem of insufficient oxidation resistance and strength, high porosity of precursor ceramics, Uneven conductivity changes and other problems, to achieve the effect of complete compact structure, simple molding method, and good oxidation resistance

Active Publication Date: 2018-07-31
HARBIN INST OF TECH
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  • Abstract
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Problems solved by technology

[0007] In order to solve the problems of high porosity and insufficient compactness of the existing precursor ceramics, which lead to insufficient oxidation resistance and strength of the prepared precursor ceramic sensors, and measurement errors due to uneven conductivity changes, the present invention adopts a liquid forming method , the liquid ceramic precursor is directly cured at high temperature without adding a curing agent, and a dense precursor ceramic temperature sensor suitable for extreme environments is prepared

Method used

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  • Method for preparing dense precursor ceramic temperature sensor
  • Method for preparing dense precursor ceramic temperature sensor
  • Method for preparing dense precursor ceramic temperature sensor

Examples

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preparation example Construction

[0037] The invention provides a method for preparing a dense precursor ceramic temperature sensor, the method comprising the following steps:

[0038] (1) Place the liquid ceramic precursor in a liquid forming mold and keep it warm for 0.5 to 2 hours (for example, 0.5, 0.6, 0.7, 0.8, 0.9, 1, 1.2, 1.5, 1.8 or 2h), to obtain a shaped precursor; the liquid ceramic precursor is placed under the condition of 150°C to 200°C (for example, at a temperature of 150°C to 200°C In the tube furnace) insulation is to make it carry out preliminary cross-linking and curing molding.

[0039] (2) Put the shaped precursor obtained in step (1) at 350°C to 450°C (such as 350°C, 360°C, 370°C, 380°C, 390°C, 400°C, 410°C, 420°C, 430°C, 440°C or 450°C) for 3 to 6 hours (such as 3, 3.5, 4, 4.5, 5, 5.5, or 6 hours) to obtain a precursor block; to mold the precursor at 350 to 450°C (for example, at a temperature of 350 ℃ ~ 450 ℃ tube furnace) insulation is to achieve complete crosslinking and curing of...

Embodiment 1

[0054] use as Figure 4 The liquid forming mold shown (the liquid forming mold is made of polytetrafluoroethylene material) prepares a dense type precursor ceramic temperature sensor, the precursor ceramic is a SiCN precursor ceramic, and the electrode is a platinum electrode. The electrodes are connected to the SiCN precursor ceramics by using liquid polysilazane as an adhesive. The SiCN precursor ceramics are prepared as follows.

[0055] Firstly, the air bubbles in the liquid polysilazane are removed by vacuuming (vacuumizing for 1 h), and then the liquid polysilazane is poured into the liquid forming mold; then, the argon protective atmosphere is introduced, and the In a type furnace, the temperature was raised to 180°C at a rate of 3°C / min, and kept for 1 hour for preliminary cross-linking and curing molding to obtain a molding precursor; then the molding precursor was taken out of the liquid molding mold, and the molding precursor was placed in the Put it into a tube f...

Embodiment 2

[0058] Example 2 is basically the same as Example 1, except that the pyrolysis temperature is 1100°C.

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Abstract

The invention relates to a method for preparing a dense precursor ceramic temperature sensor. The method comprises the steps of: placing a liquid ceramic precursor in a liquid forming mold and keepingthe iquid ceramic precursor at 150 to 200 degrees centigrade for 0.5 to 2h to obtain a formed precursor; keeping the formed precursor at 350 to 450 degrees centigrade for 3 to 6h to obtain a precursor block; pyrolyzing the precursor block at 1000 to 1450 degrees centigrade for 3 to 6h to obtain a precursor ceramic; connecting an electrode to the precursor ceramic to obtain a dense precursor ceramic temperature sensor. The invention uses a liquid forming method, and directly cures the liquid ceramic precursor at a high temperature without adding a curing agent, thereby obtaining a dense precursor ceramic temperature sensor suitable for an extreme environment. The temperature sensor has good oxidation resistance, high strength and accurate measurement results.

Description

technical field [0001] The invention belongs to the technical field of temperature sensors, in particular to a preparation method of a dense precursor ceramic temperature sensor. Background technique [0002] Temperature sensors used in extreme environments, such as sensors used in engines or various combustion and heating systems, are relatively scarce. The main challenge is to withstand high temperature, high pressure and strong oxidative corrosion environments in extreme environments. Si-based materials have controllable electronic properties and rapidly developing microfabrication methods. However, pure Si sensors are prone to degradation at high temperatures, so they generally do not exceed 350°C; although SiC-based sensors have improved the test temperature range, they generally do not exceed 500°C. [0003] Sensor materials based on precursor ceramics have excellent high-temperature stability, outstanding oxidation and corrosion resistance, and high-temperature semic...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01K7/00C04B35/58C04B35/64B28B7/24B28B11/24
CPCB28B7/24B28B11/243C04B35/58C04B35/64C04B2235/602C04B2235/6562C04B2235/77G01K7/00
Inventor 易法军牛家宏孟松鹤金华方国东许承海解维华
Owner HARBIN INST OF TECH
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