Preparation method of epoxy resin conductive adhesive film

Abstract

The invention discloses a preparation method of an epoxy resin conductive adhesive film and a conductive adhesive layer of the epoxy resin conductive adhesive film. The conductive adhesive layer of the epoxy resin conductive adhesive film comprises the following components in percentage by mass: 20-35% of epoxy resin, 40-50% of copper powder with silver plated on the surface, 10-25% of a solvent, 10-20% of a toughening agent, 1-2% of a curing agent, 0.5-1% of a promoter, 1-3% of a coupling agent and 0.5-1% of a reducing agent namely formaldehyde. The preparation method comprises the steps of firstly mixing components, then coating mixed slurry on a release film by using a coating machine, and implementing the process according to the set temperature and tension in the coating process. Single metal powder is replaced by using a composite conductive filling material of the copper powder with silver plated on the surface, and the specific temperature and tension values set aiming at the characteristics of the slurry on the coating machine are combined so as to ensure that the working efficiency of the coating machine can be increased to reach 10-15m / min, and the production efficiency of products can be improved by more than 3 times at most.

Description

technical field [0001] The invention relates to a technology in the field of microelectronic packaging connection materials, in particular to a preparation method of an epoxy resin conductive adhesive film and a conductive adhesive layer thereof. Background technique [0002] Conductive adhesive is an adhesive with a certain conductivity after curing or drying. It usually uses matrix resin and conductive fillers, namely conductive particles, as the main components. The conductive particles are combined through the bonding effect of the matrix resin to form a conductive adhesive. Pathway to realize the conductive connection of the adhered material. Since the matrix resin of the conductive adhesive is an adhesive, a suitable curing temperature can be selected for bonding. At the same time, due to the miniaturization and miniaturization of electronic components and the rapid development of high density and high integration of printed circuit boards, The conductive adhesive can...

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Problems solved by technology

[0004] However, there are some problems in the existing resin conductive adhesives on the market, such as high viscosity of epoxy resin conductive adhesives, low heat resistance, chemical resistance, poor toughness, and expensive fillers, etc., especially the traditional single Metal powder or graphite conductive filler is difficult to coat evenly, which brings obstacles to the coating operation. The coating efficiency of the coating machine is generally only 5m / min. The production efficiency of the product is low and cannot be further improved, and the production cost is low. high

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