Preparation method of epoxy resin conductive adhesive film

A technology of epoxy resin and conductive adhesive film, applied in epoxy resin adhesive, conductive adhesive, film/sheet adhesive, etc., can solve the problem of difficult uniform coating, low heat resistance, poor toughness, etc problem, to achieve the effect of long storage time, low viscosity and good high temperature resistance

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A technology of epoxy resin and conductive adhesive film, applied in epoxy resin adhesive, conductive adhesive, film/sheet adhesive, etc., can solve the problem of difficult uniform coating, low heat resistance, poor toughness, etc problem, to achieve the effect of long storage time, low viscosity and good high temperature resistance

CN104017511BActive Publication Date: 2016-04-13SHANDONG JINDING ELECTRONICS MATERIALS CO LTD

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Embodiment 1

[0025] The epoxy resin conductive adhesive film provided in this embodiment includes a release film and a conductive adhesive layer coated on the release film. The conductive adhesive layer includes the following components in terms of mass percentage:

[0026]

[0027] The preparation method includes the following steps: firstly mix epoxy resin, toughening agent and curing agent, then add accelerator, coupling agent and reducing agent, fully stir, then add copper powder and solvent coated with silver on the surface of conductive filler, and airtightly mix , to effectively avoid the volatilization of the solvent; then use the coating machine to coat the above-mentioned mixed slurry on the release film, and during the coating process, set the temperature and tension as follows:

[0028] 1) Coating machine temperature setting

[0029] Coating Oven Section

CH1

CH2

CH3

CH4

CH5

CH6

CH7

temperature / ℃

70

90

100

120

13...

Embodiment 2

[0035] The epoxy resin conductive adhesive film provided in this embodiment includes a release film and a conductive adhesive layer coated on the release film. The conductive adhesive layer includes the following components in terms of mass percentage:

[0036]

[0037] The toughening agent is a mixture of nitrile rubber and high molecular weight epoxy resin;

[0038] The preparation method includes the following steps: firstly mix epoxy resin, toughening agent and curing agent, then add accelerator, coupling agent and reducing agent, fully stir, then add copper powder and solvent coated with silver on the surface of conductive filler, and airtightly mix , to effectively avoid the volatilization of the solvent; then use the coating machine to coat the above-mentioned mixed slurry on the release film, and during the coating process, set the temperature and tension as follows:

[0039] 1) Coating machine temperature setting

[0040] Coating Oven Section

CH1

...

Embodiment 3

[0046] The epoxy resin conductive adhesive film provided in this embodiment includes a release film and a conductive adhesive layer coated on the release film. The conductive adhesive layer includes the following components in terms of mass percentage:

[0047]

[0048] The preparation method includes the following steps: firstly mix epoxy resin, toughening agent and curing agent, then add accelerator, coupling agent and reducing agent, fully stir, then add copper powder and solvent coated with silver on the surface of conductive filler, and airtightly mix , to effectively avoid the volatilization of the solvent; then use the coating machine to coat the above-mentioned mixed slurry on the release film, and during the coating process, set the temperature and tension as follows:

[0049] 1) Coating machine temperature setting

[0050] Coating Oven Section

CH1

CH2

CH3

CH4

CH5

CH6

CH7

temperature / ℃

70

90

100

120

13...

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Abstract

The invention discloses a preparation method of an epoxy resin conductive adhesive film and a conductive adhesive layer of the epoxy resin conductive adhesive film. The conductive adhesive layer of the epoxy resin conductive adhesive film comprises the following components in percentage by mass: 20-35% of epoxy resin, 40-50% of copper powder with silver plated on the surface, 10-25% of a solvent, 10-20% of a toughening agent, 1-2% of a curing agent, 0.5-1% of a promoter, 1-3% of a coupling agent and 0.5-1% of a reducing agent namely formaldehyde. The preparation method comprises the steps of firstly mixing components, then coating mixed slurry on a release film by using a coating machine, and implementing the process according to the set temperature and tension in the coating process. Single metal powder is replaced by using a composite conductive filling material of the copper powder with silver plated on the surface, and the specific temperature and tension values set aiming at the characteristics of the slurry on the coating machine are combined so as to ensure that the working efficiency of the coating machine can be increased to reach 10-15m / min, and the production efficiency of products can be improved by more than 3 times at most.

Description

technical field [0001] The invention relates to a technology in the field of microelectronic packaging connection materials, in particular to a preparation method of an epoxy resin conductive adhesive film and a conductive adhesive layer thereof. Background technique [0002] Conductive adhesive is an adhesive with a certain conductivity after curing or drying. It usually uses matrix resin and conductive fillers, namely conductive particles, as the main components. The conductive particles are combined through the bonding effect of the matrix resin to form a conductive adhesive. Pathway to realize the conductive connection of the adhered material. Since the matrix resin of the conductive adhesive is an adhesive, a suitable curing temperature can be selected for bonding. At the same time, due to the miniaturization and miniaturization of electronic components and the rapid development of high density and high integration of printed circuit boards, The conductive adhesive can...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine

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Application Information

Patent Timeline

13 Apr 2016

Publication

CN104017511B

IPC: C09J7/02; C09J163/00; C09J163/02; C09J9/02; C09J11/04; C09J11/06; C09J11/08; H01L23/29

Inventors: 欧阳彦辉; 耿国凌