Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Graphene conductive glue

A technology of conductive glue and graphene, which is applied in the field of conductive glue, can solve the problems that the conductive glue cannot meet the requirements of use, and achieve the effects of good conductive effect, improved conductive performance, and strong adhesion

Inactive Publication Date: 2018-08-03
山东中亿烯创新材料科技有限公司
View PDF2 Cites 4 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

With the widespread use of conductive adhesives, the requirements for their conductivity are getting higher and higher, and the conductive adhesives in the prior art can no longer meet the requirements for use.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0019] The present invention proposes a graphene conductive glue, whose raw materials are formulated as follows by weight: 50 parts of conductive epoxy resin, 10 parts of liquid silicone rubber, 12 parts of non-ionic EDTA, 10 parts of conductive powder, 4 parts of silver paste, vinyl 5 parts of silicone oil, 5 parts of methyl hydrogen silicone oil, 3 parts of acrylamide, 3 parts of styrene, 3 parts of crosslinking agent, 3 parts of reinforcing agent, and 5 parts of other reagents.

[0020] The other reagents are specifically a mixture of defoamers, surfactants, catalysts, and flame retardants, and the molar mass ratio of the defoamers, surfactants, catalysts, and flame retardants is 0.5:2:2:1.

[0021] The conductive powder is specifically a mixture of single-layer graphene, multi-layer graphene, nickel powder and flake copper powder, and the molar mass ratio of single-layer graphene, multi-layer graphene, nickel powder and flake copper powder is 1:10 :1:5.

[0022] Before us...

Embodiment 2

[0025] The present invention proposes a kind of graphene conductive glue, and its raw material formula by weight is as follows: 55 parts of conductive epoxy resin, 13 parts of liquid silicone rubber, 13 parts of non-ionic EDTA, 13 parts of conductive powder, 4.5 parts of silver paste, vinyl 6 parts of silicone oil, 6 parts of methyl hydrogen silicone oil, 3.5 parts of acrylamide, 3.5 parts of styrene, 3.5 parts of crosslinking agent, 3.5 parts of reinforcing agent, and 5.5 parts of other reagents.

[0026] The other reagents are specifically a mixture of defoamers, surfactants, catalysts, and flame retardants, and the molar mass ratio of the defoamers, surfactants, catalysts, and flame retardants is 0.5:2:2:1.

[0027] The conductive powder is specifically a mixture of single-layer graphene, multi-layer graphene, nickel powder and flake copper powder, and the molar mass ratio of single-layer graphene, multi-layer graphene, nickel powder and flake copper powder is 1:10 :1:5.

...

Embodiment 3

[0031] The present invention proposes a kind of graphene conductive glue, and its raw material formula by weight is as follows: 60 parts of conductive epoxy resin, 15 parts of liquid silicone rubber, 14 parts of non-ionic EDTA, 15 parts of conductive powder, 5 parts of silver paste, vinyl 7 parts of silicone oil, 7 parts of methyl hydrogen silicone oil, 4 parts of acrylamide, 4 parts of styrene, 4 parts of crosslinking agent, 4 parts of reinforcing agent, and 6 parts of other reagents.

[0032] The other reagents are specifically a mixture of defoamers, surfactants, catalysts, and flame retardants, and the molar mass ratio of the defoamers, surfactants, catalysts, and flame retardants is 0.5:2:2:1.

[0033] The conductive powder is specifically a mixture of single-layer graphene, multi-layer graphene, nickel powder and flake copper powder, and the molar mass ratio of single-layer graphene, multi-layer graphene, nickel powder and flake copper powder is 1:10 :1:5.

[0034] Befo...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
diameteraaaaaaaaaa
Login to View More

Abstract

The invention discloses graphene conductive glue. The graphene conductive glue is prepared from raw materials in parts by weight as follows: 50-70 parts of conductive epoxy resin, 10-20 parts of liquid silicone rubber, 12-16 parts of nonionic EDTA, 10-20 parts of conductive powder, 4-6 parts of silver paste, 5-9 parts of vinyl silicone oil, 5-9 parts of methyl hydrogen silicone oil, 3-5 parts of acrylamide, 3-5 parts of styrene, 3-5 parts of a crosslinking agent, 3-5 parts of a reinforcing agent and 5-7 parts of other reagents. The graphene conductive glue has high adhesion force and good conductive effect, can mainly solve the problems of non-firmness and layering between intercepting strips and graphene coatings in the electrothermal film industry and is suitable for large-scale popularization.

Description

technical field [0001] The invention relates to the technical field of conductive glue, in particular to a graphene conductive glue. Background technique [0002] Conductive adhesive is an adhesive with a certain conductivity after curing or drying. It usually uses matrix resin and conductive fillers, namely conductive particles, as the main components. The conductive particles are combined through the bonding effect of the matrix resin to form a conductive adhesive. Pathway to realize the conductive connection of the adhered material. Since the matrix resin of the conductive adhesive is an adhesive, a suitable curing temperature can be selected for bonding. At the same time, due to the miniaturization and miniaturization of electronic components and the rapid development of high density and high integration of printed circuit boards, The conductive adhesive can be made into a paste to achieve high line resolution. Moreover, the conductive adhesive has a simple process, is...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J183/04C09J183/07C09J183/05C09J9/02
CPCC08K2003/0806C08K2003/085C08K2003/0862C08K2201/014C08L2205/025C08L2205/035C09J9/02C09J163/00C08L83/04C08K13/04C08K7/00C08K3/042C08K3/08
Inventor 黄治鸿夏友良
Owner 山东中亿烯创新材料科技有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products