Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Mushroom bran recycling method

A technology for bacteria bran and fungi, applied in the field of bacteria bran recycling and reuse, can solve the problems of many types and large output of bacteria bran, and achieve the effects of low cost, good buffer performance and light weight.

Active Publication Date: 2018-08-07
深圳市南理工技术转移中心有限公司
View PDF7 Cites 4 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the output of edible mushroom chaff in my country is large and there are many types, so it is necessary to continue to develop new ways of resource utilization

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] Embodiment 1 This embodiment discloses a method for recycling and regenerating fungus chaff, and the steps of the recycling method include:

[0024] (1) Preparation of fungus chaff: first sort the recycled waste fungus chaff, remove plastic and other non-biological parts, then dry and crush the fungus chaff, and pass the pulverized fungus chaff through a 16-mesh particle size sieve for later use;

[0025] (2) Base material preparation: mix the fungus chaff treated in step 1 with corn stalks, bagasse, and bran in a ratio of 20:45:20:15; mix the above components evenly and add them to the culture medium Nutrient solution (the mass fraction of described nutrient solution comprising potassium dihydrogen phosphate, magnesium sulfate, vitamin B, and glucose is respectively 0.2%, 0.05%, 0.05%, and 2%) of 1.3 times the weight of the base material is evenly sprayed on the nutrient solution On the surface of the base material, stir evenly after absorbing for 90 minutes; adjust th...

Embodiment 2

[0031] Embodiment 2 This embodiment discloses a method for recycling and regenerating fungus chaff, the steps of the recycling method include:

[0032] (1) Preparation of fungus chaff: first sort the recycled waste fungus chaff, remove plastic and other non-biological parts, then dry and crush the fungus chaff, and pass the pulverized fungus chaff through a 16-mesh particle size sieve for later use;

[0033] (2) Base material preparation: mix the fungus chaff treated in step 1 with corn stalks, rice straw, and bran in a ratio of 10:55:15:20; mix the above components evenly and add base 1.3 times the weight of the nutrient solution (the nutrient solution contains potassium dihydrogen phosphate, magnesium sulfate, vitamin B, and glucose with a mass fraction of 0.2%, 0.05%, 0.05%, and 2% respectively), and the nutrient solution is evenly sprayed on the base After absorbing for 90 minutes, stir evenly; adjust the water content of the base material to 60%-70%;

[0034] (3) Mushroo...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention belongs to the field of biological material recycling, and particularly relates to a mushroom bran recycling method. In the method, mushroom bran, straw, corncobs, bagasse, rice straw and other forestry and agricultural residues serve as the raw materials, with the aid of a nutrient solution, by means of the characteristics of rapid growth of fungal hyphae and strong twisting capacity of mycelia, the mushroom bran and the forestry and agricultural residues are converted into a mycelium composite, and the composite has the advantages of being light in weight, low in cost and capable of being degraded, so the resourceful utilization of the mushroom bran is realized, and the mushroom bran can be used for the fields of light packaging and transporting, is excellent in compressingand buffering performance, can relieve the environment air pollution and improve economic benefits, is an environment-friendly material with great market economic value and can be applied in the field of transporting and packaging.

Description

technical field [0001] The invention belongs to the field of biological materials, and in particular relates to a method for recycling fungus chaff. Background technique [0002] At present, edible fungi have become an indispensable part of people's daily diet because they contain high protein, low fat, low energy, rich in mineral elements and vitamins. With the promotion of edible fungi technology and the expansion of factory scale, my country's edible fungi has developed extremely rapidly and has become a major producer of edible fungi. Therefore, more and more cultivation wastes, i.e. fungal chaff, are produced. Practice has shown that for every 100 kilograms of compost, after receiving 100 kilograms of fresh mushrooms, 60 kilograms of fungus chaff waste will be produced. In 2014, my country's annual output of edible fungi was 31.6968 million tons, and more than 19 million tons of fungus chaff was produced. In some large provinces producing edible fungi, the chaff is of...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): A01G18/00A01G18/20
Inventor 彭志立黄梦婷陈强
Owner 深圳市南理工技术转移中心有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com