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Resin composition, prepreg and laminate for high-speed and high-frequency printed circuit board

A technology of resin composition and printed circuit board, which is applied in the fields of resin composition for high-speed and high-frequency printed circuit boards, prepregs and laminates, can solve the problems of polyphenylene sulfide resin performance defects, poor toughness, etc., and achieve excellent Heat resistance, good heat resistance, effect of enhancing binding force

Active Publication Date: 2020-06-30
ZHEJIANG WAZAM NEW MATERIAL CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Unfortunately, it is insoluble in conventional organic solvents and has poor toughness. As a result, in the field of electronic materials, especially in the field of copper-clad laminates, polyphenylene sulfide has not become a hot spot for application.
Although Taiwan's patent application TW201800237A uses polyphenylene sulfide resin as one of the raw materials for laminates, pure polyphenylene sulfide resin still has defects in performance

Method used

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  • Resin composition, prepreg and laminate for high-speed and high-frequency printed circuit board
  • Resin composition, prepreg and laminate for high-speed and high-frequency printed circuit board
  • Resin composition, prepreg and laminate for high-speed and high-frequency printed circuit board

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Embodiment Construction

[0027] The following specific examples are further descriptions of the methods and technical solutions provided by the present invention, but should not be construed as limiting the present invention.

[0028] The source of raw materials used in the embodiment and the product name are as follows in the specific embodiment:

[0029] (A) Ultrafine polyphenylene sulfide powder:

[0030] A-1 FZ-1140(DIC) PPS

[0031] A-2 BR111BL (Phillips) toughened modified PPS

[0032] (B) Allyl modified benzoxazine:

[0033] B-1 Allyl modified bisphenol A benzoxazine resin

[0034] B-2 Allyl modified dicyclopentadienyl phenolic benzoxazine resin

[0035] (C) Maleic anhydride modified butadiene:

[0036] C-1 Ricon 130MA20 (Sartomer) Anhydride content 20%

[0037] C-2 Ricon 130MA8 (Sartomer) Anhydride content 8%

[0038] (D) curing accelerator:

[0039] BTPB (Shikoku Chemicals) Butyltriphenylphosphine bromide

[0040] DCP (Shanghai Gaoqiao) dicumyl peroxide

[0041] (E) Filler:

[0042...

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Abstract

The invention discloses a laminated board, a prepreg and a resin composition for a high-speed high-frequency printed circuit board. The resin composition is prepared from, by weight, 35-70 parts of ultrafine polyphenylene sulfide resin micropowder, 25-45 parts of allyl modified benzoxazine, 20-40 parts of maleic anhydride modified butadiene, 0.001-5 parts of a curing accelerator and 20-100 parts of filler. The prepreg comprises a base material and the resin composition attached to the base material after impregnation and drying. The laminated board comprises at least one of the prepreg. The laminated board and the prepreg prepared from the resin composition have advantages of low dielectric constant, low dielectric loss tangent value, high glass-transition temperature, high heat resistance, low hydroscopicity, high size stability and the like.

Description

technical field [0001] The invention belongs to the technical field of electronic substrates, and in particular relates to a resin composition for a high-speed and high-frequency printed circuit board, a prepreg and a laminated board. Background technique [0002] Nowadays, with the rapid development of global information technology, digitalization and networking have become a major global trend. Cloud computing and cloud storage technologies are also constantly seeking major breakthroughs. The information carrying, processing and transmission capabilities of electronic products are constantly facing challenges. Lighter and thinner, circuit wiring is gradually moving towards higher density, which requires the copper clad laminate material with signal transmission capability to have a lower dielectric constant. In order to ensure the integrity of signal transmission, realize high-speed transmission, and reduce process heat dissipation, copper clad laminates are required to ha...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L61/34C08L81/02C08L47/00C08K3/36C08J5/24B32B15/08B32B27/04
CPCB32B15/08B32B2260/046B32B2307/204B32B2307/306B32B2307/3065B32B2361/00B32B2386/00B32B2457/08C08J5/24C08J2361/34C08J2381/02C08J2447/00C08J2461/34C08J2481/02C08L61/34C08L81/02C08L2201/08C08L2203/20C08L2205/03C08L47/00C08K3/36
Inventor 梁希亭潘锦平彭康陈忠红盛佳炯竺孟晓
Owner ZHEJIANG WAZAM NEW MATERIAL CO LTD