Mask plate and its preparation method and oled film encapsulation process

Abstract

The invention provides a mask plate used in OLED thin film encapsulation technology, comprising: a hollowed out part, the hollowed out part includes openings for forming a thin film encapsulation layer on a substrate, and the area where the thin film encapsulation layer is formed is the thin film encapsulation area ; the cover part, the cover part is used to cover the non-thin-film encapsulation area of ​​the substrate; the cover part is provided with a rib protruding toward the direction of the substrate, when the mask plate is aligned with the substrate , the rib abuts against the base plate. Thereby, the non-thin film encapsulation area is separated from the thin film encapsulation area. During the OLED thin film encapsulation process using the mask, the mask effectively blocks the diffusion of film material molecules to the non-thin film encapsulation area, avoiding The phenomenon of regionally deposited thin film layer simplifies the technological process and reduces the production cost; the invention also provides a preparation method of the mask plate, and the technological process is simple.

Description

technical field [0001] The invention relates to the technical field of organic photoelectric devices, in particular to a mask, a preparation method thereof, and an OLED thin film encapsulation process using the mask. Background technique [0002] OLED (Organic Light-Emitting Diode, Organic Light-Emitting Diode) device has excellent performance such as fast response speed, wide viewing angle, high brightness, low power consumption, etc., and is a self-luminous device. It is considered to be a next-generation display technology with great development prospects. . Silicon-based microdisplay is a high PPI (Pixels Per Inch) display device, and its packaging methods still use three methods: cover plate type, Frit and thin film encapsulation (Thin Film Encapsulation). Based on the advantages and disadvantages of the three methods, thin-film packaging is more suitable for silicon-based microdisplays. [0003] In recent years, atomic layer deposition (ALD) has been widely used in O...

AI Technical Summary

Problems solved by technology

Please refer to figure 1 As shown, in the current ALD deposition process, the mask (Mask) 10 is placed above the substrate 20, and because the film molecule 30 has a strong drilling ability, it often passes through the gap between the mask 10 and the substrate 20 , deposit a thin film layer in the non-display area 40 (Bonding area) that does not need to deposit a thin film, resulting in the inability to achieve bonding (Bonding)

Usually, the film layer needs to be peeled off by dry etching exposure and other processes, which increases equipment investment costs and process links, and increases production costs.

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