Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Manufacturing method for chemical mechanical polishing pad as well as product thereof and mould

A chemical machinery and manufacturing method technology, applied in manufacturing tools, grinding/polishing equipment, grinding tools, etc., can solve the problem of poor bonding reliability between the window and the polishing layer body, poor overall process and quality stability of the polishing layer, and polishing layer body. Problems such as poor internal structure uniformity, to achieve the effect of firm and reliable window fitting, improved uniform stability and yield, and excellent uniform stability

Inactive Publication Date: 2018-08-28
CHENGDU TIMES LIVE SCI & TECH
View PDF9 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The invention provides a manufacturing method of a chemical mechanical polishing pad, its product and a mold to solve the problems of poor process and quality stability of the polishing layer as a whole, poor uniformity of the internal structure of the polishing layer body and the like in the chemical polishing pad with an endpoint detection window. The problem of poor bonding reliability between the window and the polishing layer body

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Manufacturing method for chemical mechanical polishing pad as well as product thereof and mould
  • Manufacturing method for chemical mechanical polishing pad as well as product thereof and mould
  • Manufacturing method for chemical mechanical polishing pad as well as product thereof and mould

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0041] A manufacturing method of a chemical mechanical polishing pad, which is a one-time integrated casting molding process comprising the following steps:

[0042] The end point detection window is obtained by machining the casting temperature resistant, optically transparent solid material and the solid window material according to the shape and size;

[0043] The obtained end point detection window is press-fitted and fixed at the designed fixed position in the cavity of the casting mold for the polishing layer of the polishing pad through the pressure generated by the size difference;

[0044] After the mold is closed, pour the polishing layer castable into the mold cavity, and keep it for a period of time under a certain curing temperature;

[0045] Cooling and demoulding to obtain a polishing pad polishing layer inlaid and bonded with an end point detection window;

[0046] The obtained polishing layer and the substrate layer with through holes opened according to the ...

Embodiment 2

[0048] A manufacturing method of a chemical mechanical polishing pad, which is a one-time integrated casting molding process, comprising the following steps:

[0049] The end point detection window is obtained by machining the casting temperature resistant, optically transparent solid material and the solid window material according to the shape and size;

[0050] The obtained end point detection window is fixed at the designed fixed position in the cavity of the casting mold of the polishing pad polishing layer through the double-sided tape of the casting temperature;

[0051] After the mold is closed, pour the polishing layer castable into the mold cavity, and keep it for a period of time under a certain curing temperature;

[0052] Cooling and demoulding to obtain a polishing pad polishing layer inlaid and bonded with an end point detection window;

[0053] The obtained polishing layer and the substrate layer with through holes opened according to the design requirements o...

Embodiment 3

[0055] A manufacturing method of a chemical mechanical polishing pad, which is a one-time integrated casting molding process, comprising the following steps:

[0056] The end point detection window is obtained by machining the casting temperature resistant, optically transparent solid material and the solid window material according to the shape and size;

[0057] installing the obtained end point detection window into the pre-opened grooves on the cavity wall of the polishing layer casting mold of the polishing pad with matching dimensions;

[0058] After the mold is closed, pour the polishing layer castable into the mold cavity, and keep it for a period of time under a certain curing temperature;

[0059] Cooling and demoulding to obtain a polishing pad polishing layer inlaid and bonded with an end point detection window;

[0060] The obtained polishing layer and the substrate layer with through holes opened according to the design requirements of the polishing pad are bond...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a manufacturing method for a chemical mechanical polishing pad, the chemical mechanical polishing pad manufactured by the manufacturing method and provided with a final point detecting window, and a matched single-piece or multi-piece combined type casting mould. In the process, the formed solid final point detecting window is embedded and nested into a polishing layer of the chemical and mechanical polishing pad through a once integrated casting and forming process, so that the polishing layer firmly bonded with the window is directly manufactured. The single-piece or multi-piece combined type casting mould is utilized for precisely controlling casting process parameters of the polishing layer with the window, and the obtained product polishing pad body is excellentin density distribution, cavity rate and uniformity of cavity size, so that integral process and quality stability of the polishing pad are obtained. The contact surface between the window of the product and the polishing layer body is bonded under chemical and physical dual effects, so that the bonding effect is extremely good, and therefore, a leakage phenomenon caused by cracks of the contactsurface in a using process is eliminated. Therefore, the manufacturing method has remarkable practical popularization value.

Description

technical field [0001] The invention relates to the field of chemical mechanical polishing, in particular to a manufacturing method of a chemical mechanical polishing pad, its product and a mold. Background technique [0002] With the continuous upgrading of the semiconductor manufacturing process, the lithography technology has higher and higher requirements on the degree of planarization of the wafer surface. Chemical mechanical polishing technology, also known as chemical mechanical planarization technology, as the only technology that can achieve global surface planarization in the current wafer integrated circuit processing, plays a key role in the surface treatment of wafers. [0003] As an important consumable in chemical mechanical polishing technology, the chemical mechanical polishing pad has the following functions: effectively and uniformly transport the polishing liquid to different areas of the polishing pad; To achieve the removal effect; to maintain the poli...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): B29C39/10B29C39/22B29C39/26B24D18/00B24B37/26
Inventor 相红旗
Owner CHENGDU TIMES LIVE SCI & TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com