Diffusion-welding connecting method taking Ti foil and titanium-based solder foil as interlayer
A connection method and intermediate layer technology, applied in welding equipment, non-electric welding equipment, metal processing equipment, etc., can solve problems such as limited research reports and achieve the effect of optimizing welding parameters
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Embodiment 1
[0025] This embodiment adopts Ti foil and titanium-based solder foil as the diffusion welding connection method of the intermediate layer to connect TiAl alloy and Ti 2 AlNb alloy, the steps of the method are:
[0026] Step 1. Using wire cutting to combine TiAl alloy with Ti 2 The AlNb alloy is processed into the required size to obtain the base metal to be welded;
[0027] Step 2: Grinding the surface to be welded of the base material to be welded with sandpaper, and then performing polishing treatment, the polished base material to be welded, Ti foil with a thickness of 10-50 μm and titanium-based solder foil with a thickness of 30-60 μm Ultrasonic cleaning in acetone for 3 to 10 minutes;
[0028] The composition system of the titanium-based solder foil includes Ti-Cu-Ni, Ti-Zr-Cu-Ni, Ti-Zr-Cu-Ni-Co(Fe), Ti-Zr-Fe;
[0029] Step 3, the Ti foil is in contact with the surface to be welded of the TiAl alloy, and the titanium-based solder foil and the Ti 2 AlNb alloy is in co...
Embodiment 2
[0032] The difference between this embodiment and the first embodiment is that the first step is to use wire cutting to separate the TiAl alloy and Ti 3 The Al-based alloy is processed into the required size, and what is described in step 3 is to contact the surface to be welded with the Ti foil and the TiAl alloy, and the titanium-based solder foil and the Ti 3 The surface to be welded of the Al-based alloy is in contact, and the composition is Ti 3 Al-based alloy / titanium-based solder foil / Ti foil / TiAl alloy welded workpiece. Others are the same as in Embodiment 1.
Embodiment 3
[0034] The difference between this embodiment and the first embodiment is that in the third step, the Ti foil with a thickness of 20-30 μm is placed in acetone for ultrasonic cleaning. Others are the same as in Embodiment 1.
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