Diffusion-welding connecting method taking Ti foil and titanium-based solder foil as interlayer
A connection method and intermediate layer technology, applied in welding equipment, non-electric welding equipment, metal processing equipment, etc., can solve problems such as limited research reports and achieve the effect of optimizing welding parameters
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[0024] Example one
[0025] This embodiment uses Ti foil and titanium-based solder foil as the intermediate layer of the diffusion welding connection method to connect TiAl alloy and Ti 2 AlNb alloy, the steps of this method are:
[0026] Step 1: Use wire cutting to combine TiAl alloy with Ti 2 AlNb alloy is processed into the required size to obtain the base material to be welded;
[0027] Step 2. After polishing the welded surface of the base material to be welded with sandpaper, perform polishing treatment. The polished base material to be welded, Ti foil with a thickness of 10-50μm and a titanium-based solder foil with a thickness of 30-60μm Put it in acetone and ultrasonically clean for 3~10min;
[0028] The composition system of the titanium-based solder foil includes Ti-Cu-Ni, Ti-Zr-Cu-Ni, Ti-Zr-Cu-Ni-Co(Fe), Ti-Zr-Fe;
[0029] Step three, contact the Ti foil with the surface to be welded of the TiAl alloy, and the titanium-based solder foil and Ti 2 The AlNb alloy is in contact...
Example Embodiment
[0031] Example two
[0032] The difference between this embodiment and the first embodiment is: in step one, the TiAl alloy and Ti 3 The Al-based alloy is processed to the required size. In step 3, the Ti foil is in contact with the surface to be welded of the TiAl alloy, and the titanium-based solder foil is 3 The Al-based alloy is in contact with the surface to be welded, and the resultant structure is Ti 3 Al-based alloy / titanium-based solder foil / Ti foil / TiAl alloy to be welded workpiece. Others are the same as the first embodiment.
Example Embodiment
[0033] Example three
[0034] The difference between this embodiment and the first embodiment is that in step 3, the Ti foil with a thickness of 20-30 μm is ultrasonically cleaned in acetone. Others are the same as the first embodiment.
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