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Preparation method of plastic wood sectional material based on waste circuit board resin powder

A technology for waste circuit boards and resin powder, applied in the field of composite materials, can solve the problems of poor water resistance, mildew resistance, poor structural toughness, shortage of wood resources, and large consumption of wood, etc., to achieve good appearance and performance, improve overall toughness, Guaranteed effect of extrusion rate and quality

Inactive Publication Date: 2018-09-04
苏州市富荣环保科技有限公司 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, at present, wood powder is basically used in the production of plant fibers for plastic wood, and the use of wood powder requires a large amount of wood, resulting in a shortage of wood resources.
At the same time, the use of a large amount of wood powder makes the water resistance, mildew resistance and structural toughness of the profiles poor

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] A method for preparing wood-plastic profiles based on waste circuit board resin powder, comprising the following steps:

[0032] (1) Pretreatment of waste circuit board resin powder: First, the waste circuit board resin powder is crushed by a crusher, and then screened and collected by an electrostatic separator for standby use. The particle size of the powder is 120-150 mesh.

[0033] (2) Modification of waste circuit board resin powder: put 100 parts of collected waste circuit board resin powder and 1 part of sodium succinate sulfonate in a high-speed mixer at 100°C, mixing speed 400r / min, mix for 40min, and then Add 12 parts of γ-(2,3-glycidyloxypropoxy)propyltrimethoxysilane and monoalkoxy unsaturated fatty acid carbonate at a mass ratio of 4:1, and mix for 20 minutes.

[0034] (3) Premix: 50% of modified waste circuit board resin powder, 25% of recycled polyethylene plastic particles, 8% of POE elastomer, 10% of nano silicon dioxide, 2% of stearate, 3% of maleic a...

Embodiment 2

[0038] A method for preparing wood-plastic profiles based on waste circuit board resin powder, comprising the following steps:

[0039] (1) Pretreatment of waste circuit board resin powder: First, the waste circuit board resin powder is crushed by a crusher, and then screened and collected by an electrostatic separator for standby use. The particle size of the powder is 120-150 mesh.

[0040] (2) Modification of waste circuit board resin powder: Put 100 parts of collected waste circuit board resin powder and 3 parts of dioctyl sodium sulfosuccinate in a high-speed mixer at 110°C with a mixing speed of 500r / min. After 45 minutes, 10 parts of the mixture of γ-(2,3-epoxypropoxy)propyltrimethoxysilane and monoalkoxy unsaturated fatty acid carbonate in a mass ratio of 4:1 was added, and mixed for 30 minutes.

[0041](3) Premix: 45% modified waste circuit board resin powder, 27% recycled polyethylene plastic particles, 8% POE elastomer, 8% nano silicon dioxide, 3% stearic acid, male...

Embodiment 3

[0045] A method for preparing wood-plastic profiles based on waste circuit board resin powder, comprising the following steps:

[0046] (1) Pretreatment of waste circuit board resin powder: First, the waste circuit board resin powder is crushed by a crusher, and then screened and collected by an electrostatic separator for standby use. The particle size of the powder is 120-150 mesh.

[0047] (2) Modification of waste circuit board resin powder: Put 100 parts of collected waste circuit board resin powder and 5 parts of dioctyl sodium sulfosuccinate in a high-speed mixer at 120°C with a mixing speed of 480r / min. After 50 minutes, add 15 parts of the mixture of γ-(2,3-epoxypropoxy)propyltrimethoxysilane and monoalkoxy unsaturated fatty acid carbonate in a mass ratio of 4:1, and mix for 25 minutes.

[0048] (3) Premix: 48% of modified waste circuit board resin powder, 30% of recycled polyethylene plastic particles, 7% of POE elastomer, 5% of nano silicon dioxide, 3% of stearic ac...

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Abstract

The invention discloses a preparation method of a plastic wood sectional material based on waste circuit board resin powder and belongs to the technical field of composite materials. According to thepreparation method of the plastic wood sectional material based on the waste circuit board resin powder, through preprocessing and modification of the waste circuit board resin powder, pre-mixing, preparation of the sectional material, surface after-processing and other steps, the plastic wood sectional material is prepared. According to the preparation method, the waste circuit board resin powderis adopted for completely replacing wood powder, harmless and resource utilization of the waste circuit board resin powder is achieved, the shortage of wood material resources is relieved, and meanwhile the prepared plastic wood sectional material is environmentally friendly and has excellent waterproofness, mildew resistance and structural toughness.

Description

technical field [0001] The invention relates to the technical field of composite materials, in particular to a method for preparing wood-plastic profiles based on waste circuit board resin powder. Background technique [0002] Abandoned printed circuit boards are a kind of electronic waste that is common in daily life. It contains more than a dozen metals with high recycling value, such as copper, gold, silver, and palladium. The recovery of precious metals and valuable metals, while ignoring the recovery and reuse of non-metals. At present, the crushing method is often used to separate the metal and non-metal in the printed circuit board, and the metal is mainly recovered, while the non-metallic material in the discarded printed circuit board is thrown away as garbage. This will cause a lot of waste of resources and environmental pollution. Rational use of these wastes to achieve resource recovery is conducive to the sustainable development of resources, energy and societ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L101/00C08L23/06C08L23/08C08L51/06C08K3/36C08K5/42C08K5/5435C08K5/098C08K13/02
CPCC08K2201/011C08L101/00C08L2205/035C08L23/06C08L23/0815C08L51/06C08K3/36C08K5/42C08K5/5435C08K5/098C08K13/02
Inventor 殷瞿明周玲娟朱方政
Owner 苏州市富荣环保科技有限公司
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