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Laser packaging OLED illumination panel and packaging method

A laser encapsulation and panel technology, applied in the field of OLED lighting, can solve problems such as the reduction of process yield, and achieve the effects of improving product yield, reducing damage, and reducing glass cracks

Active Publication Date: 2018-09-07
江苏壹光科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] The purpose of the present invention is to provide a laser-encapsulated OLED lighting panel and a packaging method to solve the technical problem of reduced process yield in the existing laser packaging technology due to sharp temperature rise and fall, and to increase the pressure resistance of the OLED lighting panel, thereby reducing the number of panels. Occurrence of short circuit

Method used

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  • Laser packaging OLED illumination panel and packaging method

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Experimental program
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Effect test

Embodiment 1

[0039]The laser-encapsulated OLED lighting panel of this embodiment includes a substrate (10) at the bottom, a cover (20) at the top, and a light-emitting device (30) arranged between the substrate (10) and the cover (20). A cooling liquid (40) is also included between the base plate (10) and the cover plate (20), and a seal for sealing the light emitting device (30) and the cooling liquid (40) in the base plate (10) and the cover plate (20) Body (50).

[0040] The substrate (10) is a glass substrate;

[0041] The cover plate (20) is a glass cover plate, the glass cover plate is a groove cover plate, and the groove area corresponds to the position of the cooling liquid, and the groove thickness of the groove cover plate is less than 0.6mm.

[0042] The light emitting device (30) includes a cathode, an anode and a light emitting unit.

[0043] The sealing body (50) is glass frit, and its material is composed of glass powder, oxide filler, adhesive and resin as a carrier.

[...

Embodiment 2

[0054] The product structure of the present embodiment is the same as that of the embodiment. Materials and preparation methods vary.

[0055] The material of the cooling liquid (40) is methyl silicone oil, and further dehydration treatment is carried out before use to ensure that the cooling liquid does not absorb moisture, thereby ensuring the quality of the lighting panel.

[0056] The preparation method of the laser-encapsulated OLED lighting panel of this embodiment includes the following steps:

[0057] S1. The light-emitting device is installed on the substrate by using a coating process. The light-emitting device here includes an anode, a light-emitting unit and a cathode. The coating process uses thermal evaporation coating.

[0058] S2. Using a dispenser to coat the glass frit on the substrate to form a set pattern;

[0059] S3. Use the physical dehydration method to dehydrate the cooling liquid under low vacuum;

[0060] S4. Use a dispenser to coat the cooling li...

Embodiment 3

[0066] The product structure of the present embodiment is the same as that of the embodiment. Materials and preparation methods vary.

[0067] The material of the cooling fluid (40) is fluorosilicone oil, and CaO is added to the fluorosilicone oil. The addition of CaO can make the cooling fluid have an additional drying and water absorption function, which can better ensure that the OLED device will not be damaged by water vapor, thereby The service life of the device is further improved.

[0068] The preparation method of the laser-encapsulated OLED lighting panel of this embodiment includes the following steps:

[0069] S1. The light-emitting device is installed on the substrate by using a coating process. The light-emitting device here includes an anode, a light-emitting unit and a cathode. The coating process uses thermal evaporation coating.

[0070] S2. Using a dispenser to coat the glass frit on the substrate to form a set pattern;

[0071] S3. Add a certain amount o...

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Abstract

The invention provides a laser packaging OLED illumination panel featured by comprising a bottom substrate (10), a top cover plate (20), and a luminescent device (30) arranged between the substrate (10) and the cover plate (20); a cooling liquid (40) is arranged between the substrate (10) and the cover plate (20); a sealing body (50) used for sealing the luminescent device (30) and the cooling liquid (40) is arranged between the substrate (10) and the cover plate (20); by using said structure, the product yield can be greatly improved, thus reducing defects caused by glass and organic materialdamages under local heating, increasing lamp sheet anti-compression capability, and further improving the yield rate.

Description

technical field [0001] The invention relates to the technical field of OLED lighting, in particular to a laser packaging OLED lighting panel and a packaging method. Background technique [0002] In recent years, OLEDs (Organic Light Emitting Diodes) have been used more and more in the fields of display and lighting. Since the organic materials in OLED devices are very sensitive to oxygen and water, the infiltration of water vapor and oxygen will cause fatal defects such as black spots and black spots, so encapsulation technology is very important in the preparation of OLED panels. [0003] The mainstream OLED packaging technologies mainly include the following three types: 1. UV glue sealing packaging; 2. Laser glass powder packaging; 3. Thin film packaging. Among them, the first packaging method is relatively simple, but the sealing performance is poor, and a desiccant needs to be added as an auxiliary. The life of OLED devices using this packaging method is relatively s...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L51/52H01L51/56
CPCH10K50/841H10K50/846H10K71/00
Inventor 卢泓徐亚晨黄刚毅
Owner 江苏壹光科技有限公司
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