Method for utilizing ultraviolet light to activate bonded glass and other materials arranged in a stacked manner

An ultra-violet, superimposed technology, applied in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve the problems of being easily interfered by human factors, low activation efficiency, etc., to improve activation efficiency, improve bonding quality, Reduce the effect of adsorption

Active Publication Date: 2018-09-11
HARBIN INST OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In order to solve the problems of low activation efficiency of the above-mentioned ultraviolet light bonding method and the interference of human factors during the bonding process, the present invention provides a method for using ultraviolet light to activate and bond superimposed glass and other materials

Method used

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  • Method for utilizing ultraviolet light to activate bonded glass and other materials arranged in a stacked manner
  • Method for utilizing ultraviolet light to activate bonded glass and other materials arranged in a stacked manner
  • Method for utilizing ultraviolet light to activate bonded glass and other materials arranged in a stacked manner

Examples

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Embodiment 1

[0025] This embodiment provides a method for bonding stacked glass and other materials using the ultraviolet light activation method, such as figure 1 As shown, the specific implementation steps are as follows:

[0026] (1) Clean the material to be bonded and the wedge:

[0027] Soak the glass wafers, silicon carbide wafers and two wedge-shaped wafers with a length of 15mm, a width of 5mm and a thickness of 0.5mm in deionized water, all of which are 10×10×0.5mm in size, and perform ultrasonic cleaning for 10 minutes. Stream to dry.

[0028] (2) Place the wedge-shaped piece:

[0029] Take two wedges of the above size and place them on the edge of the silicon carbide wafer.

[0030] (3) Place the glass wafer:

[0031] The cleaned glass wafer on the side to be bonded is opposed to the silicon carbide wafer on the side to be bonded and placed above the wedge-shaped wafer.

[0032] (4) Activate the wafer pair to be bonded:

[0033] Place the silicon carbide wafer and glass wafer pair to be bon...

Embodiment 2

[0039] This embodiment provides a method for bonding stacked glass and other materials by using the ultraviolet light activation method. The specific implementation steps are as follows:

[0040] (1) Clean the material to be bonded and the wedge:

[0041] Soak the glass wafers, silicon wafers and two wedge-shaped wafers with a length of 15mm, a width of 5mm and a thickness of 0.5mm in deionized water, which are all 10×10×0.5mm in size, and perform ultrasonic cleaning for 10 minutes. Blow dry.

[0042] (2) Place the wedge-shaped piece:

[0043] Take two wedges of the above size and place them on the edge of the silicon wafer.

[0044] (3) Place the glass wafer:

[0045] The cleaned glass wafer on the side to be bonded is opposed to the silicon wafer on the side to be bonded and placed above the wedge.

[0046] (4) Activate the wafer pair to be bonded:

[0047] Place the silicon wafer and glass wafer pair to be bonded at a distance of 1 mm directly below the ultraviolet light source (the di...

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Abstract

The invention discloses a method for utilizing ultraviolet light to activate bonded glass and other materials arranged in a stacked manner. The method includes the following steps: cleaning surfaces of to-be-bonded materials; placing a wedge-shaped wafer; placing a glass wafer; activating a to-be-bonded wafer pair, removing the wedge-shaped wafer; and manually carrying out pressing to finish bonding. According to the method, ultraviolet light can penetrate the glass wafer to activate the to-be-bonded surfaces of the materials below and in-situ bonding during activation is carried out. In thisway, absorption of pollutant particles on hydrophilic surfaces can be reduced, interference of human factors can be reduced to a certain extent, the bonding quality of glass and other materials can beimproved effectively, and defects during bonding can be reduced.

Description

Technical field [0001] The invention belongs to the technical field of wafer bonding, and relates to a method for bonding glass and other functional materials, in particular to a method for bonding superimposed glass and other functional materials by an ultraviolet light activation method. Background technique [0002] Wafer bonding refers to the process of cleaning and activating the surface of the wafer to achieve an atomic level clean surface, then bonding the two together, and achieving a covalent connection between the two through room temperature or low temperature annealing. Glass is a good light-transmitting material, and its light transmittance can reach or exceed 90% in almost all wavebands. In addition, due to its small thermal expansion coefficient (0.56×10 -6 / K), with good thermal stability, is the substrate material for many optoelectronic devices, microfluidic devices and lasers. In order to achieve the performance of the above-mentioned devices, it is usually ne...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/02
CPCH01L21/0201
Inventor 王晨曦许继开王源吴斌康秋实王特赵珈辉李义邦田艳红
Owner HARBIN INST OF TECH
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