LED epitaxial structure and growth method therefor
A technology of epitaxial growth and growth temperature, which is applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve the problems of increasing the recombination efficiency of holes and electrons in the light-emitting layer, and increasing the high optical power, so as to improve the level of hole injection and reduce the working voltage , Improve the effect of activation efficiency
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Embodiment 1
[0049] The invention uses VEECO MOCVD to grow high-brightness GaN-based LED epitaxial wafers. Using high-purity H 2 or high purity N 2 or high purity H 2 or high purity N 2 (purity 99.999%) mixed gas as carrier gas, high-purity NH3 (NH3 purity 99.999%) as N source, metal-organic source trimethylgallium (TMGa), metal-organic source triethylgallium (TEGa), trimethyl Indium (TMIn) is used as the indium source, trimethylaluminum (TMAl) is used as the aluminum source, the N-type dopant is silane (SiH4), the P-type dopant is dichloromagnesium (Cp2Mg), and the substrate is (0001) plane For sapphire, the reaction pressure is between 100Torr and 1000Torr. The specific growth method is as follows (for the epitaxial structure, please refer to figure 2 ):
[0050] The present invention provides an LED epitaxial structure and its growth method, see image 3 , which in turn includes:
[0051] Step 1, processing the substrate 101; Step 2, growing a low-temperature GaN nucleation lay...
Embodiment 2
[0058] The invention uses VEECO MOCVD to grow high-brightness GaN-based LED epitaxial wafers. Using high-purity H 2 or high purity N 2 or high purity H 2 or high purity N 2 (purity 99.999%) mixed gas as carrier gas, high-purity NH3 (NH3 purity 99.999%) as N source, metal-organic source trimethylgallium (TMGa), metal-organic source triethylgallium (TEGa), trimethyl Indium (TMIn) is used as the indium source, trimethylaluminum (TMAl) is used as the aluminum source, the N-type dopant is silane (SiH4), the P-type dopant is dichloromagnesium (Cp2Mg), and the substrate is (0001) plane For sapphire, the reaction pressure is between 100Torr and 1000Torr. The specific growth method is as follows (for the epitaxial structure, please refer to figure 2 ):
[0059] 1. Treat the substrate, specifically:
[0060] Place the sapphire substrate in H 2 Annealing is carried out in the atmosphere to clean the surface of the substrate, and the temperature is 1050°C-1150°C.
[0061] 2. Gro...
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