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High-strength low-thermal-expansion-coefficient microcrystalline glass and preparation method thereof

A low thermal expansion coefficient, glass-ceramic technology, used in glass manufacturing equipment, glass molding, manufacturing tools and other directions, can solve the problems of high thermal expansion coefficient, low bending strength, large dielectric loss, etc., to achieve simple process, bending resistance, etc. The effect of high strength and low dielectric loss

Inactive Publication Date: 2018-09-21
UNIV OF ELECTRONICS SCI & TECH OF CHINA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The purpose of the present invention is to provide a high strength low Thermal expansion coefficient glass-ceramics and a preparation method thereof, the electronic packaging substrate made of the material has a low thermal expansion coefficient, can achieve good thermal matching with a silicon chip, has high bending strength, and has good dielectric properties, simple production process, High stability and low cost

Method used

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  • High-strength low-thermal-expansion-coefficient microcrystalline glass and preparation method thereof
  • High-strength low-thermal-expansion-coefficient microcrystalline glass and preparation method thereof
  • High-strength low-thermal-expansion-coefficient microcrystalline glass and preparation method thereof

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Embodiment 1

[0026] This embodiment provides a high-strength low thermal expansion coefficient glass-ceramics, its composition is: MgO is 15wt%, Al 2 o 3 27wt%, SiO 2 48wt%, B 2 o 3 3wt%, ZnO 2wt%, ZrO 2 5wt%, accurately calculate the corresponding actual amount of hydroxide, wet ball mill for 2 hours, mix evenly and dry, put in a crucible and melt at 1450°C for 1 hour, water quench to get glass slag, and ball mill the glass slag for 1 hour After drying to obtain glass powder, the glass powder was wet ball milled with deionized water for 7 hours to obtain a uniformly dispersed powder, the powder was granulated with acrylic acid as a binder, pressed and molded, sintered at 900 ° C and kept for 1 Hours, high-strength and low thermal expansion coefficient glass-ceramics can be obtained, and its mechanical properties, dielectric properties and thermal properties are shown in the following table.

Embodiment 2

[0028] This embodiment provides a kind of glass-ceramics with high strength and low coefficient of thermal expansion, its composition is: MgO is 13wt%, Al 2 o 3 29wt%, SiO 2 46wt%, B 2 o 3 3wt%, ZnO 3wt%, ZrO 2 6wt%, accurately calculate the corresponding actual amount of hydroxide, wet ball mill for 2 hours, mix evenly and dry, put in a crucible and melt at 1450°C for 1 hour, get glass slag after water quenching, and ball mill the glass slag for 1 hour After drying to obtain glass powder, the glass powder was wet ball milled with deionized water for 7 hours to obtain a uniformly dispersed powder, the powder was granulated with acrylic acid as a binder, pressed and molded, sintered at 900 ° C and kept for 1.5 Hours, high-strength and low thermal expansion coefficient glass-ceramics can be obtained, and its mechanical properties, dielectric properties and thermal properties are shown in the following table.

Embodiment 3

[0030] This embodiment provides a kind of glass ceramics with high strength and low coefficient of thermal expansion, its composition is: MgO is 11wt%, Al 2 o 3 31wt%, SiO 2 44wt%, B 2 o 3 3wt%, ZnO 4wt%, ZrO 2 7wt%, accurately calculate the actual amount of hydroxide, wet ball mill for 2 hours, mix evenly and dry, put in a crucible and melt at 1475°C for 1 hour, water quench to get glass slag, and ball mill the glass slag for 1 hour After drying to obtain glass powder, the glass powder was wet ball milled with deionized water for 6 hours to obtain a uniformly dispersed powder, the powder was granulated with acrylic acid as a binder, pressed and molded, sintered at 875 ° C and kept for 1.5 Hours, high-strength and low thermal expansion coefficient glass-ceramics can be obtained, and its mechanical properties, dielectric properties and thermal properties are shown in the following table.

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Abstract

The invention belongs to the field of electronic ceramic materials, and particularly provides high-strength low-thermal-expansion-coefficient microcrystalline glass and a preparation method thereof. The microcrystalline glass is used for solving the problems that an existing ceramic material is high in thermal expansion coefficient (poor in matching degree with a silicon chip), low in bending strength, high in dielectric constant, large in dielectric loss and the like. The high-strength low-thermal-expansion-coefficient microcrystalline glass which is low in thermal expansion coefficient (2.5-3.5*10<-6> / DEG C), high in bending strength (200-280 MPa), high in Young modulus (90-110 GPa), low in dielectric constant (5.0-5.5@1MHz), low in dielectric loss (0.3-0.5*10<-3>@1MHz), insulating and reliable can be prepared from the components and through the preparation technology, and requirements of LTCC electronic packaging substrate materials are met; meanwhile, the microcrystalline glass issimple in process, high in stability, low in production cost and suitable for industrial batch production.

Description

technical field [0001] The invention belongs to the field of electronic ceramic materials, and relates to a glass-ceramic with high strength and low thermal expansion coefficient and a preparation method thereof. The material is suitable for electronic packaging, especially for ultra-large-scale integrated circuits. Background technique [0002] The rapid development of the modern semiconductor industry has led to the development of electronic packaging technology to a more advanced high-density, three-dimensional packaging situation, which puts forward higher requirements for electronic packaging substrate materials. Electronic ceramic materials have stable performance in terms of mechanical, electrical, and thermal properties. , have been widely used in various packaging forms. [0003] Low-temperature co-fired ceramics (LTCC) have developed rapidly in the field of packaging materials due to their excellent mechanical, dielectric, and thermal properties. LTCC technology ha...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C03C10/00C03B19/06
CPCC03B19/06C03C10/0045
Inventor 李波荆柯
Owner UNIV OF ELECTRONICS SCI & TECH OF CHINA
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