Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Regenerating method for Al/Al2O3 part of TD/DRM process of semiconductor 8-inch wafer film process

A technology of semiconductors and wafers, which is applied in the field of semiconductor process product regeneration, can solve the problems of mechanical damage and performance impact of semiconductor parts, and achieve the effects of easy recycling, thorough cleaning and regeneration, and shortened regeneration time and cost

Active Publication Date: 2018-09-25
苏州珮凯科技有限公司
View PDF11 Cites 3 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

To improve SCCO 2 In order to improve the cleaning effect and efficiency, some studies have introduced mechanical agitation, which can reduce the cleaning pressure and improve the cleaning effect, but mechanical agitation is likely to cause mechanical damage to semiconductor components and affect their performance.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Regenerating method for Al/Al2O3 part of TD/DRM process of semiconductor 8-inch wafer film process

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] Al / Al of the TD / DRM process of the semiconductor 8-inch wafer film manufacturing process of the present invention 2 o 3 Components include Baffle Plate(Al / Al 2 o 3 ), Cover Bellows (Al / Al 2 o 3 ), Upper Electrode (Al / Al 2 o 3 ), Shield Depo (Al / Al 2 o 3 ) four parts; the present invention is based on four kinds of Al / Al 2 o 3 The structure of the parts is used to select the regeneration process, because the four Al / Al 2 o 3 Parts have structures such as inner chambers and grooves. Therefore, regeneration by dry ice particle blasting alone will cause incomplete regeneration. Ultrasonic assisted supercritical CO 2 Will result in increased regeneration time and cost.

[0032] Al / Al of the TD / DRM process of the semiconductor 8-inch wafer film manufacturing process of the present invention 2 o 3 The regeneration method of parts, comprises the following steps:

[0033] (1) Al / Al of the TD / DRM process of the semiconductor 8-inch wafer thin film process to be reg...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to a regenerating method for an Al / Al2O3 part of a TD / DRM process of a semiconductor 8-inch wafer film process. The method comprises the steps that dry ice particles are sprayedand cleaned to regenerate the surface of the part; local temperature difference change formed by thermal energy absorption of dry ice during a sublimation process is used to generate a 'shear stress'between a substrate and a cleaned object, and the cleaned object is quickly peeled off from the surface of the substrate; a Venturi nozzle can generate a carbon dioxide gas stream containing more dryice particles; ultrasonic assisted supercritical CO2 cleaning regenerates the inner surface, the chamber and the groove of the part; and supercritical CO2 easily penetrates into the micropores and thechamber or groove of the part to dissolve pollutants, so that the pollutants migrate fast in supercritical CO2 to achieve the purpose of cleaning. Ultrasonic assisting further improves the cleaning effect and efficiency. The regeneration time and cost are shortened. The regenerating method has the advantages of simple process, environmental protection, being pollution-free and good regeneration effect, does not damage the semiconductor part, and has no impact on the performance of the part.

Description

technical field [0001] The invention belongs to the technical field of semiconductor manufacturing technology product regeneration, and relates to Al / Al in the TD / DRM process of semiconductor 8-inch wafer film manufacturing process 2 o 3 Parts regeneration method. Background technique [0002] In the semiconductor manufacturing process, an ultra-clean environment is required. Before installation and use of the semiconductor manufacturing equipment, especially the components of the chamber, pollutants such as particles and impurities on the surface need to be removed to meet the processing requirements. With the development of semiconductor technology, semiconductor devices are accelerating towards miniaturization, high density / high integration, and very small contaminants such as particles, metal impurities, and surface adsorbed chemical substances in semiconductor manufacturing sites have also become It is enough to affect the yield and reliability of semiconductor device...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/02
CPCH01L21/02057H01L21/02101
Inventor 范银波
Owner 苏州珮凯科技有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products