Regenerating method for Al/Al2O3 part of TD/DRM process of semiconductor 8-inch wafer film process
A technology of semiconductors and wafers, which is applied in the field of semiconductor process product regeneration, can solve the problems of mechanical damage and performance impact of semiconductor parts, and achieve the effects of easy recycling, thorough cleaning and regeneration, and shortened regeneration time and cost
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[0031] Al / Al of the TD / DRM process of the semiconductor 8-inch wafer film manufacturing process of the present invention 2 o 3 Components include Baffle Plate(Al / Al 2 o 3 ), Cover Bellows (Al / Al 2 o 3 ), Upper Electrode (Al / Al 2 o 3 ), Shield Depo (Al / Al 2 o 3 ) four parts; the present invention is based on four kinds of Al / Al 2 o 3 The structure of the parts is used to select the regeneration process, because the four Al / Al 2 o 3 Parts have structures such as inner chambers and grooves. Therefore, regeneration by dry ice particle blasting alone will cause incomplete regeneration. Ultrasonic assisted supercritical CO 2 Will result in increased regeneration time and cost.
[0032] Al / Al of the TD / DRM process of the semiconductor 8-inch wafer film manufacturing process of the present invention 2 o 3 The regeneration method of parts, comprises the following steps:
[0033] (1) Al / Al of the TD / DRM process of the semiconductor 8-inch wafer thin film process to be reg...
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