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Photosensitive resin printing method without solid supporting

A photosensitive resin, solid technology, applied in the field of 3D printing, can solve the problems of high cost and maintenance cost of high-power laser equipment, long preheating, cooling time, restricting molding accuracy, etc., to reduce the cost of production raw materials, high molding quality, The effect of convenient surface treatment

Inactive Publication Date: 2018-09-28
无锡映型三维数字技术有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Among them, the FDM technology uses coiled wire-shaped raw materials, which are cheap, but its forming speed is slow and the precision is low, and the surface of the workpiece needs subsequent polishing treatment; the surface quality of the workpiece produced by the SLS technology is also poor, and it requires a long preheating before and after processing. Cooling time, high-power laser equipment cost and maintenance cost are extremely high; while SLA technology has fast forming speed, strong working stability, and high precision, so its application prospects are broad; DLP printing speed is faster than SLA, Also with great precision and finesse
For 3D printing, due to the different shapes of the manufactured workpieces, it is often necessary to add additional support parts during printing to ensure the stability of the workpiece posture, which greatly increases the cost of later workpiece processing, and also restricts the molding accuracy.

Method used

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  • Photosensitive resin printing method without solid supporting
  • Photosensitive resin printing method without solid supporting
  • Photosensitive resin printing method without solid supporting

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Experimental program
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Embodiment Construction

[0019] The present invention will be further described below in conjunction with the accompanying drawings.

[0020] A photosensitive resin printing method without solid support, which uses layer-by-layer photocuring to process the superimposed photosensitive resin layer in the height direction. The uncured liquid photosensitive resin wraps and fixes the cured workpiece.

[0021] Before the 3D printing operation, determine the orientation of the workpiece relative to the printing platform; divide the model into several slices layer by layer along the height direction of the printing platform, and obtain the cross-sectional graphics of each slice.

[0022] A closed frame is solidified on the periphery of the cross-sectional figure of each layer of slices; the frames in the slices of several layers are connected to each other to form a closed outer wall.

[0023] During 3D printing, the photosensitive resin layer is laid on the printing platform; the thickness of each photosens...

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PUM

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Abstract

The invention discloses a photosensitive resin printing method without solid supporting. Continuous closed outer walls are synchronously cured at the outer peripheries of workpieces, so that liquid-state photosensitive resins not cured in the outer walls fixedly wrap the cured workpieces, solid support pieces in the traditional printing process are omitted, the printing process is simplified, theproduction efficiency is improved, the workpiece forming quality is high, and the surface treatment is convenient; the liquid-state photosensitive resins are fully dispersed and refined before use, sothat the stability of resin layers is guaranteed, reliable supporting can be provided for the cured workpieces, the printing success rate is high, and the support removing workload after printing isreduced; and meanwhile, wastes are not generated in the whole printing process, and the photosensitive resins not cured can be recycled, so that the production raw material cost is prominently reduced.

Description

technical field [0001] The invention relates to the field of 3D printing, in particular to a photosensitive resin printing method without solid support. Background technique [0002] 3D printing, as a rapid prototyping technology, has risen rapidly and developed rapidly in recent years. Compared with traditional processing methods, 3D printing can efficiently construct three-dimensional models with complex structures at a lower cost, so it is widely used in various fields such as industrial design, architecture, automobiles, aerospace, medical treatment, and military industry. [0003] The most common 3D printing methods can be divided into FDM (fused deposition modeling), SLS (selective laser sintering of powder materials), SLA (selective curing of photosensitive resin) and DLP (digital optical processing curing, that is, image projection curing) according to their different principles. ). Among them, the FDM technology uses coiled wire-shaped raw materials, which are che...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B29C64/124B33Y10/00
Inventor 杜晖
Owner 无锡映型三维数字技术有限公司
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