Contact probe, measuring head, and manufacturing method for contact probe

A manufacturing method and test head technology, applied in the field of vertical probes, can solve the problems affecting the sliding degree of freedom of the probe, affecting the correct operation of the test head, contacting the probe card, etc., to achieve the characteristics of optimizing thermal conductivity and electrical conductivity as well as mechanical strength , good electrical and mechanical contact, the effect of small needle marks

Inactive Publication Date: 2018-09-28
MAXONE SEMICON CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0023] However, the probes (particularly their ends) may be over-retained within the guide holes, affecting the freedom of sliding of the probes themselves and affecting the correct operation of the

Method used

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  • Contact probe, measuring head, and manufacturing method for contact probe
  • Contact probe, measuring head, and manufacturing method for contact probe
  • Contact probe, measuring head, and manufacturing method for contact probe

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Embodiment Construction

[0057] The preferred embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings, so that the advantages and features of the present invention can be more easily understood by those skilled in the art, so as to define the protection scope of the present invention more clearly.

[0058] See attached figure 2 , 3 Shown, in particular, the contact probes of a test head of a device for testing electronic devices integrated on a wafer are described below.

[0059] It should be noted that these figures show a schematic view of a contact probe according to the invention and are not drawn to scale, on the contrary they are drawn to highlight important characteristics of the invention. In the figures, different parts are shown schematically, their shape can vary according to the desired application. Furthermore, measures described with respect to one embodiment and shown in one figure may also be used in other embodiments show...

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Abstract

A contact probe for a measuring head of a device for testing an electronic device includes at least one first portion, a second portion, and a third portion; the structures of the first portion, the second portion, and the third portion have continuity; the first portion, the second portion, and the third portion are different in shape; and the at least one first portion, the second portion and the third portion are simultaneously laminated by at least two conductive materials to form the contact probe, wherein one of the conductive materials is the first conductive material having high hardness and corrosion resistance, and the other conductive material is a second conductive material having high conductivity and thermal conductivity. The invention also discloses a measuring head and a manufacturing method of the contact probe, which ensure good electrical and mechanical contact between the contact probe and the contact pad of the device under test, optimize the characteristics of heat conduction and electrical conductivity and mechanical strength, and avoid problems that the probes are damaged or stuck in the respective guide holes.

Description

technical field [0001] The invention relates to the field of vertical probes, related to the probes arranged on the probe card for touching the object to be tested, and in particular to a vertical contact probe for a test head or a probe card, a test head and a contact probe. Probe manufacturing method. Background technique [0002] As is well known, a test head is essentially a device adapted to electrically connect a plurality of contact pads of a microstructure to corresponding channels of a testing machine performing its tests. [0003] Testing performed on integrated circuits can detect and isolate faulty circuits that have been present during the manufacturing phase. Typically, therefore, test heads are used to electrically test the circuits integrated on the wafer before the wafer is singulated and assembled into chip packages. [0004] A test head usually comprises a large number of contact elements or contact probes made of a special alloy with good mechanical and...

Claims

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Application Information

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IPC IPC(8): G01R1/067
CPCG01R1/06733G01R1/06755G01R1/06761G01R1/07357
Inventor 周明
Owner MAXONE SEMICON CO LTD
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