Contact probe, measuring head, and manufacturing method for contact probe

Abstract

A contact probe for a measuring head of a device for testing an electronic device includes at least one first portion, a second portion, and a third portion; the structures of the first portion, the second portion, and the third portion have continuity; the first portion, the second portion, and the third portion are different in shape; and the at least one first portion, the second portion and the third portion are simultaneously laminated by at least two conductive materials to form the contact probe, wherein one of the conductive materials is the first conductive material having high hardness and corrosion resistance, and the other conductive material is a second conductive material having high conductivity and thermal conductivity. The invention also discloses a measuring head and a manufacturing method of the contact probe, which ensure good electrical and mechanical contact between the contact probe and the contact pad of the device under test, optimize the characteristics of heat conduction and electrical conductivity and mechanical strength, and avoid problems that the probes are damaged or stuck in the respective guide holes.

Description

technical field [0001] The invention relates to the field of vertical probes, related to the probes arranged on the probe card for touching the object to be tested, and in particular to a vertical contact probe for a test head or a probe card, a test head and a contact probe. Probe manufacturing method. Background technique [0002] As is well known, a test head is essentially a device adapted to electrically connect a plurality of contact pads of a microstructure to corresponding channels of a testing machine performing its tests. [0003] Testing performed on integrated circuits can detect and isolate faulty circuits that have been present during the manufacturing phase. Typically, therefore, test heads are used to electrically test the circuits integrated on the wafer before the wafer is singulated and assembled into chip packages. [0004] A test head usually comprises a large number of contact elements or contact probes made of a special alloy with good mechanical and...

AI Technical Summary

Problems solved by technology

[0023] However, the probes (particularly their ends) may be over-retained within the guide holes, affecting the freedom of sliding of the probes themselves and affecting the correct operation of the test head as a whole

Under extreme conditions, the contact probes may become "stuck" in the pilot holes, completely stopping the operation of the test head and requiring the test head to be replaced

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