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Ceramic adapter plate structure and manufacturing method thereof

A manufacturing method and technology of an adapter board, which is applied in semiconductor/solid-state device manufacturing, electrical components, electric solid-state devices, etc., can solve problems such as inability to meet the fine circuit design requirements of packaging adapter boards and affecting signal integrity

Active Publication Date: 2018-09-28
SHANGHAI JIAO TONG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, since the density of high-temperature pressed ceramic substrates is lower than that of silicon substrates and glass substrates, there are pores inside the substrate. Therefore, as the through-hole density of the ceramic interposer increases, crosstalk may occur between the through-holes through the pores, which will seriously affect the integrity of the signal. , unable to meet the fine circuit design requirements of the packaging adapter board

Method used

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  • Ceramic adapter plate structure and manufacturing method thereof
  • Ceramic adapter plate structure and manufacturing method thereof
  • Ceramic adapter plate structure and manufacturing method thereof

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Embodiment Construction

[0050] In the following description, the present invention is described with reference to various examples. One skilled in the art will recognize, however, that the various embodiments may be practiced without one or more of the specific details, or with other alternative and / or additional methods, materials, or components. In other instances, well-known structures, materials, or operations are not shown or described in detail so as not to obscure aspects of the various embodiments of the invention. Similarly, for purposes of explanation, specific quantities, materials and configurations are set forth in order to provide a thorough understanding of embodiments of the invention. However, the invention may be practiced without these specific details. Furthermore, it should be understood that the various embodiments shown in the drawings are illustrative representations and are not necessarily drawn to scale.

[0051] In this specification, reference to "one embodiment" or "the...

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Abstract

The invention discloses a ceramic adapter plate structure, which comprises a ceramic substrate, a first surface insulating layer, a second surface insulating layer and a conductive through hole, wherein the first surface insulating layer is arranged at the first side of the ceramic substrate; the second surface insulating layer is arranged at the second side, opposite to the first side, of the ceramic substrate; and the conductive through hole is arranged in the ceramic substrate and penetrates through the ceramic substrate.

Description

technical field [0001] The invention relates to the technical field of semiconductor packaging, in particular to a ceramic adapter plate structure and a manufacturing method thereof. Background technique [0002] Since the invention of the integrated circuit, with the continuous development of the miniaturization of electronic devices, the integration of electronic systems has become higher and higher. However, the physical size of the current device is close to the technical limit of two-dimensional devices. Performance improvements have been very limited. [0003] As a new method of system-level packaging, three-dimensional integration technology makes full use of the z-direction space and becomes an effective way for large-scale integration. Among them, through-substrate hole technology is the main trend to realize 3D stacked packaging. Through vertical interconnection, circuits can be made on both sides of the adapter board, which greatly shortens the interconnection di...

Claims

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Application Information

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IPC IPC(8): H01L23/498H01L23/538H01L21/48
CPCH01L21/4846H01L23/498H01L23/49894H01L23/538H01L2224/16225H01L2224/48091H01L2224/48227H01L2924/15311H01L2924/181H01L2924/00014H01L2924/00012
Inventor 孙雅婷丁桂甫孙云娜石现
Owner SHANGHAI JIAO TONG UNIV
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