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Preparing method of epoxy resin composite material with low heat conductivity coefficient

A low thermal conductivity, epoxy resin technology, applied in the field of polymer material molding processing, can solve the problem of uneven heating

Inactive Publication Date: 2018-10-12
姚子巍
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] In order to solve the problem of uneven local heating in the existing epoxy resin thermocompression molding process, the present invention provides a method for preparing epoxy resin composite materials with low thermal conductivity

Method used

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Embodiment Construction

[0014] The invention provides a method for preparing an epoxy resin composite material with low thermal conductivity. The preparation method includes pressing and molding the epoxy resin by hot pressing, and the composite material includes accurately controlling the amount of copper powder added to make it satisfy Vf= (a*ρ*c-Em) / (Ef-Em).

[0015] In order to achieve better results, it is necessary to design the thermal conductivity according to the situation, and the calculation of the thermal conductivity is roughly calculated according to the mixing law:

[0016] E. c =E f V f +E m (1-V f )

[0017] Among them, Ec is the thermal conductivity of epoxy resin composite material, Ef is the thermal conductivity of copper powder, Em is the thermal conductivity of epoxy resin, and Vf is the volume fraction of copper powder.

[0018] It is worth noting that in the actual process, other fillers may also be included. When calculating the thermal conductivity, necessary adjustmen...

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Abstract

The invention relates to the field of molding of high polymer materials, and particularly discloses a preparing method of an epoxy resin composite material with a low heat conductivity coefficient. The preparing method comprises the step that epoxy resin is subjected to compression molding through hot-press molding. The preparing method is characterized in that the composite material comprises copper powder and meets the following relationship Vf=(a*rho*c-Em) / (Ef-Em), wherein Vf is the volume fraction of the copper powder, a is the heat diffusion coefficient of the composite material, the unitof a is m<2> / s, rho is the density of the composite material, the unit of rho is kg / m<3>, c is the specific heat at constant pressure, the unit of c is J(Kg*K), Ef and Em are the heat conductivity coefficients of the copper powder and the epoxy resin respectively, and the unit of Ef and Em is W / (m.K), wherein Vf is smaller than 3%. By determining the adding amount of the copper powder, the problem of uneven local heating is solved in the premise that the heat-conducting property of the composite material is improved in a small scale, and thermal stress of the epoxy resin composite material with the low heat conductivity coefficient in a molding process is removed.

Description

technical field [0001] The invention relates to the field of polymer material molding and processing, in particular to a method for preparing an epoxy resin composite material with low thermal conductivity. Background technique [0002] Epoxy resin is a conventional industrial resin, which is widely used in many fields. Epoxy resin is usually a thermosetting resin, which will not be dissolved or melted after curing, and can only be thermoformed once. The most conventional epoxy resin is usually formed by hot pressing, which belongs to the external heat radiation forming process, that is, the mold is heated by a press, and the heat is provided to the epoxy resin by an external heat source, so that the epoxy resin melts and melts. Molding under pressure, but the defect of this molding method is obvious, it is very easy to cause uneven local heating of epoxy resin products, and when making larger volume components, due to the time required for heat transfer, the external epoxy ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08K3/08
CPCC08K3/08C08K2003/085C08K2201/005C08L63/00
Inventor 姚子巍
Owner 姚子巍
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