Wafer manufacturing device of solar battery
A technology for solar cells and manufacturing devices, which is applied in the fields of final product manufacturing, sustainable manufacturing/processing, semiconductor/solid-state device manufacturing, etc. It can solve problems such as wafer quality degradation, waste of processing materials, and uneven wafer density. The effect of uniform density and high processing efficiency
Patent Information
- Authority / Receiving Office
- CN · China
- Current Assignee / Owner
- Publication Date
- 2018-10-12
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Abstract
Description
technical field
[0001] The invention belongs to the technical field of solar cell manufacturing, in particular to a solar cell wafer manufacturing device. Background technique
[0002] Wafer refers to the silicon chip used in the production of silicon semiconductor integrated circuits. Wafer is the carrier used in the production of integrated circuits. In general, wafers refer to single crystal silicon wafers. Wafer is the most commonly used semiconductor material. According to its diameter, it is divided into 4 inches, 5 inches, 6 inches, 8 inches and other specifications. Recently, 12 inches or even larger specifications have been developed. The larger the wafer, the more ICs that can be produced on the same wafer, which can reduce costs; but the requirements for material technology and production technology are higher, such as uniformity and so on. It is generally believed that the larger the diameter of the silicon wafer, it means that the fab has better technology. In ...
Examples
Embodiment Construction
[0021] In order to make the technical means, creative features, goals and effects achieved by the present invention easy to understand, the present invention will be further described below in conjunction with specific embodiments.
[0022] Such as Figure 1 to Figure 4 As shown, a solar cell wafer manufacturing device according to the present invention includes an upper mounting plate 1, an electric cylinder 2, a No. 1 motor 3, a pressurizing device 4, a mold 5, a mold frame 6, a lifting part 7, and a driver 8. The heater 9, the lower surface of the upper mounting plate 1 is fixedly connected to the base of the electric cylinder 2; the end of the cylinder rod of the electric cylinder 2 is fixedly connected to the non-output end of the No. 1 motor 3; the end of the rotating shaft of the No. 1 motor 3 Fixedly connected to the pressurizing device 4; the pressurizing device 4 includes a pressurizing roller 41 and a No. 1 bracket 42; the shaft end of the No. 1 motor 3 is fixedly c...