A single crystal silicon rod cutting machine

Abstract

This invention discloses a monocrystalline silicon rod guillotine, and belongs to the technical field of monocrystalline silicon rod processing. The monocrystalline silicon rod guillotine includes a worktable, a clamping unit, an adjusting unit and a controlling unit, wherein the worktable is used for supporting monocrystalline silicon rods; the clamping unit is used for clamping and positioning the monocrystalline silicon rods; the adjusting unit is used for adjusing the horizontal position and the height position of the worktable to allow the axial direction of the monocrystalline silicon rods located on the worktable to be perpendicular to the cutting direction of the saw blade of the guillotine; and the controlling unit is used for controlling the clamping unit and the adjusting unit.The monocrystalline silicon rod guillotine is particularly suitable for cutting and processing of the monocrystalline silicon rods with different size and front-and-back inconsistent thickness.

Description

technical field [0001] The application belongs to the technical field of single crystal silicon rod processing, and in particular relates to a single crystal silicon rod cutting machine. Background technique [0002] The method of producing monocrystalline silicon is usually to grow rod-shaped monocrystalline silicon from the melt by Czochralski method or suspension zone melting method, and the cross section of monocrystalline silicon is circular. In order to conveniently meet the shape and size of silicon wafers in the production process, it is necessary to cut off monocrystalline silicon rods. Cutting off single crystal silicon rods is an indispensable step in the early stage of the production of semiconductor devices. At present, cutting single crystal silicon is to cut single crystal silicon Rod special equipment - single crystal cutting machine. [0003] Existing single crystal cutting machines generally include a base, transmission shaft parts, cutters and monocrystal...

AI Technical Summary

Problems solved by technology

The disadvantages of this adjustment method are: the adjustment method is manual adjustment, which is not only time-consuming and laborious, but also depends entirely on human eyes to judge whether the adjustment is in place, and the error is large

[0004] In addition, during the cutting process of single crystal silicon rods in the prior art, the silicon rods are usually placed directly in the V-shaped grooves used to hold the single crystal silicon rods, or fixed by the operator manually pulling the jig. The method makes the monocrystalline silicon rods it cuts have defects

Due to the limited manpower, the silicon rod cannot be completely fixed firmly, resulting in the problem of "wavy surface and uneven surface" on the truncated surface of the silicon rod when the diamond saw blade cuts the crystal rod, which affects the product quality and reduces the work efficiency

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