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Laser processing device

A laser processing and laser technology, applied in lasers, metal processing, laser welding equipment, etc., can solve the problems of inability to precisely process dielectric films and time-consuming

Inactive Publication Date: 2018-10-23
SHIMADZU SEISAKUSHO CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Conventionally, as a method of processing a dielectric film, etching (etching) or the like was used, but this method was time-consuming, and it was not possible to precisely process a dielectric film

Method used

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  • Laser processing device
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Embodiment 1

[0024] Hereinafter, a laser processing apparatus according to an embodiment of the present invention will be described in detail with reference to the drawings. figure 1 It is a block diagram of the structure of the laser processing apparatus of Example 1 of this invention.

[0025] The laser processing apparatus includes a target part 1 for irradiating laser light, a laser irradiation part 2 for irradiating laser light to the target part 1, a blue semiconductor laser diode (laser diode) (hereinafter referred to as blue LD) 3, a laser diode driver (hereinafter referred to as LD Driver) 4, personal computer (hereinafter referred to as PC) 6, XYZ motor controller (motor controller) 7, X motor driver 8a, Y motor driver 8b, Z motor driver 8c and inert gas 9.

[0026] In the object part 1, a substrate 11, a dielectric film 12 formed on the upper surface of the substrate 11, and a heater ( heater)13. As the dielectric film 12, silicon nitride, silicon dioxide, titanium dioxide, or...

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PUM

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Abstract

A laser processing device is provided with: a thin dielectric film (12) formed on the surface of a substrate (11); a blue semiconductor laser (3) with a wavelength of 400 nm; a semiconductor laser drive unit (4) for generating continuous wave laser light in the blue semiconductor laser (3) by driving the blue semiconductor laser (3); and irradiation units (21, 22) for irradiating a processing position for the thin dielectric film (12) with continuous wave laser light generated by the blue semiconductor laser (3).

Description

technical field [0001] The present invention relates to a laser processing apparatus for processing a dielectric thin film used as a protective film of an electronic component or an antireflection film of a solar cell by laser. Background technique [0002] In electronic components, when there is no protective film formed of a dielectric thin film, the operation becomes very unstable. Therefore, a protective film formed of a dielectric thin film is coated on the electronic component. [0003] In addition, by using a dielectric thin film as an antireflection film in a solar cell or the like, the reflectance can be reduced even when the refractive index on the substrate side is high. Therefore, it is necessary to form a dielectric thin film in electronic components or solar cells. The dielectric film formed on the upper or lower portion of the substrate is an insulator, so the electrodes cannot be electrically connected to the substrate. Therefore, it is necessary to proces...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/362B23K26/08B23K26/142B23K26/402B23K26/70
CPCB23K26/402B23K26/361B23K2101/40B23K26/08B23K26/362B23K26/142B23K26/70B23K2103/50C23C16/45519H01L21/02532H01L21/67092H01S3/067
Inventor 诹访雅也坂本隼规
Owner SHIMADZU SEISAKUSHO CO LTD