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Light shielding resin composition molded product and checking method thereof

A molded product, shielding technology, applied in the direction of synthetic resin layered products, chemical instruments and methods, photosensitive materials for optomechanical equipment, etc., can solve problems such as poor detection, misinsertion, and poor alignment, and achieve high resolution High degree, excellent light-shielding property, excellent effect of light-shielding property

Pending Publication Date: 2018-11-02
SAMSUNG ELECTRO MECHANICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this case, 90° mis-insertion due to misalignment between the pocket and the chip or burrs may occur when inserting into the carrier tape
Furthermore, when the upper surface and the side surface of the thin-film high-frequency inductor have the same color, there is a problem that incorrect detection cannot be performed due to wrong insertion due to rotation.

Method used

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  • Light shielding resin composition molded product and checking method thereof
  • Light shielding resin composition molded product and checking method thereof
  • Light shielding resin composition molded product and checking method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0145] The film of Example 1 is 20 parts by weight of the carboxyl-containing resin, 2.0 parts by weight of the photopolymerization initiator, 1.6 parts by weight of the compound having an ethylenically unsaturated group, 12 parts by weight of the thermosetting resin, and the above-mentioned pigment 0.4 parts by weight of silicon dioxide and 64 parts by weight of silicon dioxide were uniformly dissolved and mixed to produce a thin film with a predetermined thickness of 20 μm. The film is cured under optimal curing conditions at an exposure dose ranging from 100 to 400 mJ and a temperature ranging from 150 to 230°C.

Embodiment 2

[0152] The film of Example 2 was produced in the following manner. For 70 parts by weight of inorganic filler, 15 parts by weight of epoxy resin, 5 parts by weight of curing agent, 2 parts by weight of polymer resin, 7 parts by weight of pigment, 1 part by weight of dispersant or curing accelerator, etc. Add solvent to other additives, and stir to 65% solid powder. After completely dissolving, apply the varnish (Varnish) with a predetermined thickness on a PET film or copper foil (Copper foil), and dry it at a temperature range of 70 to 100°C to produce a predetermined thickness of 20 μm or less. thickness of the film.

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PUM

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Abstract

The invention provides a light shielding resin composition molded product and checking method thereof. A molded product includes a body comprising a light-shielding photosensitive resin. The light-shielding photosensitive resin has a tinting strength having an L value equal than or less than 40, an a* value of -40 to -10, and a b* value less than or equal to 5 in the L*a*b* color space (CIE colorimetric system), and the light-shielding photosensitive resin has a directed transmittance (%T) of less than 10% at a wavelength band of 200 nm to 700 nm.

Description

technical field [0001] The present disclosure relates to a light-shielding resin composition and a molded article including the same. Background technique [0002] Electromagnetic Compatibility (EMC: Electro Magnetic Compatibility) field is considered to be "the growth engine of the future". That is, devices in the EMC field can be integrated into various products, and thus are selected as devices that can accelerate future regional economic growth. Examples of EMC devices include common mode ESD filters (CMEF, Common Mode ESD Filter), power inductors (Power inductor), high frequency beads (Beads), ESD filters (ESD Filter), varistors (Varistor), ESD clamp (ESD clamp) and ESD suppressor (ESD Suppressor). [0003] EMC devices are "universal electronic components" that can be applied to products in a wide range of fields, including mobile phones, home appliances, and automobiles. With the popularization of advanced electronic equipment and the increase in the density of elec...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/027G03F7/004H01F17/00H01F27/02
CPCG03F7/004G03F7/027H01F17/0013H01F27/022G02B5/003G01N21/95C08F299/028C08F290/064C08F2/50C08K3/36C08K7/18H01F17/00C08K2201/005C08J5/18G02B1/04C08J2400/24C08J2363/00C08J2300/00C08J2300/105B32B27/08
Inventor 尹今姬郑雪雅李和泳沈智慧申上恩
Owner SAMSUNG ELECTRO MECHANICS CO LTD
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