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Wire bonding tool

A wire bonding tool and wire bonding head technology, which is applied in the manufacture of electrical components, electrical solid devices, semiconductor/solid devices, etc., can solve problems such as deformation and achieve excellent electrical conductivity

Inactive Publication Date: 2018-11-02
KINIK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] An object of the present invention is to strengthen the joint strength between the wire bonding head and the work seat in the prior art wire bonding tool, and at the same time solve the problem of deformation of the working surface of the wire bonding tool that often occurs under high working temperature

Method used

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Examples

Experimental program
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no. 1 example

[0032] " figure 1 』is a structural schematic diagram of the wire bonding tool 1 according to the first embodiment of the present invention, including: a working seat 10; a bonding layer 20; a bonding head 30; and a bonding layer 20 and the bonding head 30. The first diamond layer 40 . The bonding head 30 has a working surface 31 and a non-working surface 32 , and the first diamond layer 40 is formed on the non-working surface 32 .

[0033] In the wire bonding tool 1 of this embodiment, the material of the working seat 10 may include iron-nickel alloy, iron-nickel-cobalt alloy, iron-nickel-chromium alloy, iron-cobalt-chromium alloy, or any combination thereof, and specific examples include alloys of Invar or Kovar , but the present invention is not limited thereto, and other metals or alloys with low thermal expansion coefficients can also be used.

[0034] The bonding layer 20 is disposed on one side of the work seat 10 . In this embodiment, the material of the bonding laye...

no. 2 example

[0040] Please refer to figure 2 The wire bonding tool 1 of the second embodiment of the present invention is substantially the same in structure as the wire bonding tool 1 of the first embodiment, except that this embodiment further includes a second diamond layer 50 . The second diamond layer 50 is formed on the working surface 31 of the wire bonding head 30 by a chemical vapor deposition method and directly contacts the wire bonding head 30 .

[0041] Since the compositions, structures, and features of the work base 10 , the bonding layer 20 , the bonding head 30 , and the first diamond layer 40 of this embodiment are the same as those of the first embodiment above, no further description is given here.

[0042] image 3 and Figure 4 It is a schematic diagram of a wire bonding tool in other embodiments of the present invention. The shape of the wire bonding head 30 can be designed and adjusted according to actual needs without any special limitation, as long as the bondi...

no. 3 example

[0044] Please refer to Figure 5 . The wire bonding tool 1 of the third embodiment of the present invention is substantially the same in structure as the wire bonding tool 1 of the second embodiment, the difference is that in this embodiment, there is also a An intermediate layer 80 .

[0045] Specifically, the wire bonding tool of the third embodiment of the present invention includes: the work seat 10; the bonding layer 20 arranged on one side of the work seat 10; The first diamond layer 40 on one side of the seat 10; the wire head 30 arranged on the side of the first diamond layer 40 away from the bonding layer 20; the wire head 30 arranged on a side away from the first diamond layer 40 The middle layer 80 on the side; and the second diamond layer 50 formed on the side of the middle layer 80 away from the wire bonding head 30 by chemical vapor deposition.

[0046] In this embodiment, the thickness of the intermediate layer 80 is between 0.1 μm and 20 μm, preferably betwe...

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Abstract

The invention discloses a wire bonding tool, comprising: a working base; a bonding layer, disposed on one side of the working base; a first diamond layer, formed by a chemical vapor deposition methodon one side of the bonding layer away from the working base and in direct contact with the bonding layer, wherein the first diamond layer has a single layer structure; and a wire bonding head, disposed on one side of the first diamond layer away from the bonding layer and in direct contact with the first diamond layer, wherein the wire bonding head is formed by sintering treatment through a diamond micro powder and a silicon carbide micro powder. The first diamond layer not only helps to strengthen the joint between the working base and the wire bonding head, but also reduces the deformation degree of the working surface of the wire bonding tool at a high temperature, thereby improving the service life of the wire bonding tool.

Description

technical field [0001] The invention relates to a wire-bonding tool, in particular to a wire-bonding tool with improved wear resistance and bonding strength, and is not easily deformed under high temperature. Background technique [0002] Wire bonding is one of the current methods in the industry for connecting chips to external circuits. Many factors will affect the quality of the bonding. For example, the surface of the bonding tool used in the bonding of the thermocompression bonding technology should have good thermal stability and wear resistance, so that it can be used in the bonding process. During the heating process of the manufacturing process, there will be no adverse results such as thermal deformation of the wire bonding tool. In order to pursue better quality, many research teams are committed to improving the technological level of wire bonding, and at the same time, various research and development improvements have been made to wire bonding tools. [0003]...

Claims

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Application Information

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IPC IPC(8): H01L21/603
CPCH01L24/78H01L2224/78328
Inventor 陈泰甲古峰锜何嘉哲
Owner KINIK
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