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Device for preparing high-quality high-depth-diameter-ratio micro hole by using light ray obtained through femtosecond laser time domain/space shaping

A femtosecond laser, high aspect ratio technology, used in laser welding equipment, welding equipment, manufacturing tools, etc., can solve the problems of difficulty in adjusting the diameter of micropores, limiting the practical application of micropores, and limited depth-diameter ratio of micropores. The effect of wide adjustment range of hole diameter, large aspect ratio and low cost

Active Publication Date: 2018-11-06
BEIJING INSTITUTE OF TECHNOLOGYGY
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  • Summary
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  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The depth-to-diameter ratio of microholes processed by ordinary femtosecond laser filaments is very limited, and the conversion of femtosecond laser Gaussian beams to Bessel-Gaussian beams can improve the microhole depth-to-diameter ratio, but the diameter of microholes processed by this method is relatively small. Small, generally around a few microns, and the diameter of micropores is difficult to adjust, which greatly limits the practical application of micropores processed by this method

Method used

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  • Device for preparing high-quality high-depth-diameter-ratio micro hole by using light ray obtained through femtosecond laser time domain/space shaping

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0017] The pulse time domain shaping device used is a double pulse generator similar to Michelson interferometer;

[0018] Turn on the mechanical switch 2, the laser emitted from the femtosecond laser 1 reaches the first beam splitter 3 placed at an angle of 45° to the light propagation direction, the reflected light reaches the first beam splitter 3 after being reflected by the first mirror 4, and the transmitted light is After being reflected by the second reflecting mirror 5, it also reaches the first beam splitter 3. The first reflector 4 and the second reflector 5 are adjusted so that the two beams of light reflected by them pass through the first beam splitter 3 to form a spatially coincident pulse sequence.

[0019] The second reflection mirror 5 is adjusted by using the translation stage, so that the two beams of light reflected by the first reflection mirror 4 and the second reflection mirror 5 also coincide in the time domain.

[0020] After the femtosecond laser pu...

Embodiment 2

[0029] The pulse time-domain shaping device used is a commercial pulse shaper, which is used to replace the first beam splitter 3, the first mirror 4, and the second mirror 5 in the above example.

[0030] Turn on the mechanical switch 2, the laser light emitted from the femtosecond laser 1 enters the pulse shaper, and the time-domain pulse sequence emitted from the pulse shaper reaches the second beam splitter 6, and is divided into reflected light and transmitted light with equal energy. The reflected light is focused by the first focusing lens 15 after passing through the fifth reflector 11, the second half-wave plate 12, the second polarizer 13, and the sixth reflector 14 in sequence; the transmitted light passes through the third reflector 7 and the fourth reflector in sequence. The mirror 8, the first half-wave plate 9, and the first polarizer 10 are then focused by the second focusing lens 16.

[0031] Block one of the focusing lenses so that the femtosecond laser pulse...

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Abstract

The invention relates to a device for preparing a high-quality high-depth-diameter-ratio micro hole by using a light ray obtained through femtosecond laser time domain / space shaping, and belongs to the field of transparent material micro-machining. According to the technical scheme, pulse time domain shaping equipment is used for generating a femtosecond laser pulse sequence; the position of a to-be-machined sample is adjusted to enable the light rays to generate micro holes with the maximum depths in the sample; the neutron pulse time delay of the pulse sequence is optimized so as to improvethe micro hole quality; a half-wave plate and a polarizing plate are combined for use to adjust the energy of lasers focused by two lenses correspondingly so as to enable the diameters of the micro holes formed by the lasers after being focused by the two lenses in the to-be-machined sample to be equal; the two focusing lenses are adjusted to enable the two independent light rays to be collinear in space and to be overlapped in an end-to-end mode to form an extended uniform light ray; and the position of the sample is moved to enable the light ray which is overlapped in the end-to-end mode togenerate a micro hole with the maximum depth-diameter ratio on the sample. According to the device, the quality and the depth-diameter ratio of the machined micro hole can be remarkably improved, themicro hole diameter adjusting range is wide, the machining environment is free of special requirements, the machining efficiency is high, and the machining cost is low.

Description

technical field [0001] The invention relates to a device for preparing high-quality and high-depth-diameter-ratio microholes by femtosecond laser time / space shaping light wire, which belongs to the field of micromachining of transparent materials. Background technique [0002] High-quality, high-depth-to-diameter ratio microhole processing on transparent materials has always been a difficult point in the manufacturing field. The current development of EDM drilling technology has high requirements on the conductivity of the processed material, and the focused ion beam micro-hole processing technology has disadvantages such as low processing efficiency and high cost, which are difficult to meet the requirements of high-quality, high-depth-diameter ratio micro-holes for some high-precision products. hole requirements. The microholes processed by the femtosecond laser have the characteristics of low recasting layer and few microcracks, which provide the possibility to solve the...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/382B23K26/064B23K26/03
CPCB23K26/032B23K26/064B23K26/0643B23K26/0648B23K26/382
Inventor 姜澜杜坤李晓炜王安东
Owner BEIJING INSTITUTE OF TECHNOLOGYGY
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