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Preparation method of high-adhesiveness conductive adhesive

A conductive adhesive, high-adhesion technology, used in the preparation of animal glue or gelatin, conductive adhesives, adhesives, etc., can solve the problems of decreased conductivity, poor adhesion, etc. The effect of improving adhesion

Inactive Publication Date: 2018-11-13
郭迎庆
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  • Abstract
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  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The technical problem to be solved by the present invention: Aiming at the defect that the current common conductive adhesive mostly uses metal as the conductive filler, these metal fillers are easily oxidized to form an oxide film, which leads to a decrease in conductivity and poor adhesion, and provides a high-adhesive Preparation method of conductive adhesive

Method used

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  • Preparation method of high-adhesiveness conductive adhesive

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Embodiment Construction

[0023] Weigh 500-600g bamboo slices, put them into the dryer and dry them for 5-6 hours, transfer the dried bamboo slices into the steam explosion tank of the steam explosion device, preheat the steam to 240-260°C, and pass it into the steam explosion tank. In the tank, stop feeding steam until the pressure reaches 3.6-3.8MPa, and after maintaining the pressure for 30-50s, open the discharge valve of the steam explosion tank, so that the material in the steam explosion tank is injected into the receiving tank instantaneously, and the material in the receiving tank is collected to obtain Steam explosion wet material; mix the above steam explosion wet material with a dopamine solution with a mass fraction of 10-15%, put it into a beaker, stir and react for 2-3 hours, filter and separate to obtain a reaction filter residue, and mix the reaction filter residue and a mass fraction of 15-15% The 18% ferric chloride solution is mixed according to the mass ratio of 1:10, then continue ...

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Abstract

The invention relates to a preparation method of a high-adhesiveness conductive adhesive, and belongs to the technical field of preparation of electronic materials. According to the method, firstly bamboo fiber is soaked through dopamine, and a polydopamine film with metal ion chelation is formed on the surface of the bamboo fiber under the action of dissolved oxygen in water. According to the method, collagen in scales of silver carps is extracted, the collagen has plenty of neutral amino acid and acidic amino acid, has the effect of anion aggregation, can properly absorb heavy metal, furtherhas a characteristic of antioxidant activity, ensures that heavy metal components with electric conduction effect in conductive adhesive is not easy to oxidize, the method improves the adhesiveness of the conductive adhesive through the collagen, the collagen comprises various collagen chains, the collagen chains are intertwined to form a helical structure, the structure is dense, side groups anda material substrate can perform hydrogen bond adsorption, charge adsorption and other chemical bonding force, the production of cohesive force ensures that the adhesiveness of the conductive adhesive is greatly improved, and the method has a wide application prospect.

Description

technical field [0001] The invention relates to a preparation method of a high-adhesion conductive adhesive, which belongs to the technical field of electronic material preparation. Background technique [0002] Conductive adhesive is an adhesive with a certain conductivity after curing or drying. It usually uses matrix resin and conductive fillers, namely conductive particles, as the main components. The conductive particles are combined through the bonding effect of the matrix resin to form a conductive adhesive. Pathway to realize the conductive connection of the adhered material. Since the matrix resin of the conductive adhesive is an adhesive, a suitable curing temperature can be selected for bonding. At the same time, due to the miniaturization and miniaturization of electronic components and the rapid development of high density and high integration of printed circuit boards, The conductive adhesive can be made into a paste to achieve high line resolution. Moreover,...

Claims

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Application Information

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IPC IPC(8): C09J163/00C09J189/00C09J9/02
CPCC08K2003/085C09J9/02C09J163/00C08L89/00C08K13/06C08K7/06C08K3/08
Inventor 郭迎庆蒋梦成朱彩娣
Owner 郭迎庆
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