Gold alloy bonding wire and manufacturing method thereof
An alloy bonding and bonding wire technology, applied in the field of bonding wires, can solve the problems of high requirements on bonding and reliability, unfavorable enterprises to improve competitiveness, low tensile strength of gold bonding wires, etc., to improve the anti-vulcanization ability. , Excellent anti-vulcanization performance, the effect of improving solder joint adhesion
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Embodiment 1
[0025] The gold alloy bonding wire of this embodiment contains 4.0% by weight of Pd, 25% of Ag, 4% of Pt, 180ppm of Ca, and the balance is gold.
[0026] In this embodiment, the manufacturing method of gold alloy bonding wire comprises the following steps:
[0027] (1) Melting and casting: Pd, Ag, Pt and Ca are added to the gold raw material in proportion, and after vacuum melting and directional continuous casting process, a wire rod with a diameter of 8 mm is obtained;
[0028] (2) Wire drawing: drawing the wire rod obtained in step (1) to obtain a bonded wire semi-finished product with a diameter of 0.5mm;
[0029] (3) Continue to draw the semi-finished bonding wire obtained in step (2) to obtain a gold alloy bonding wire with a diameter of 15-50 um (such as 20 um);
[0030] During the wire drawing process, intermediate annealing is carried out several times on the semi-finished product of the bonding wire. During the annealing process, N 2 As the annealing atmosphere, th...
Embodiment 2
[0035] The gold alloy bonding wire of this embodiment contains 2.2% by weight of Pd, 30% of Ag, 2.5% of Pt, 80ppm of Ca, 50ppm of Mg, 20ppm of Ce, and the balance is gold.
[0036] In this embodiment, the manufacturing method of gold alloy bonding wire comprises the following steps:
[0037] (1) Melting and casting: Pd, Ag, Pt, Ca, Mg and Ce are added to the gold raw material in proportion, and after vacuum melting and directional continuous casting process, a wire rod with a diameter of 8 mm is obtained;
[0038] (2) Wire drawing: drawing the wire rod obtained in step (1) to obtain a bonded wire semi-finished product with a diameter of 0.2 mm;
[0039] (3) Continue to draw the semi-finished bonding wire obtained in step (2) to obtain a gold alloy bonding wire with a diameter of 15-50 um (such as 20 um);
[0040] During the wire drawing process, intermediate annealing is carried out several times on the semi-finished product of the bonding wire. During the annealing process, ...
Embodiment 3
[0045] The gold alloy bonding wire of this embodiment contains 8% by weight of Pd, 20% of Ag, 3.5% of Pt, 100ppm of Ni, and the balance is gold.
[0046] In this embodiment, the manufacturing method of gold alloy bonding wire comprises the following steps:
[0047] (1) Melting and casting: Pd, Ag, Pt and Ni are added to the gold raw material in proportion, and after vacuum melting and directional continuous casting process, a wire rod with a diameter of 6 mm is obtained;
[0048] (2) Wire drawing: drawing the wire obtained in step (1) to obtain a semi-finished bonding wire with a diameter of 0.08 mm;
[0049] (3) Continue to draw the semi-finished bonding wire obtained in step (2) to obtain a gold alloy bonding wire with a diameter of 15-50 um (such as 20 um);
[0050] During the wire drawing process, intermediate annealing is carried out several times on the semi-finished product of the bonding wire. During the annealing process, N 2 As the annealing atmosphere, the effecti...
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