Sunken titanium-aluminum alloy target material provided with cooling hole

Abstract

The invention relates to the technical field of film coating processing and manufacturing, and particularly relates to a sunken titanium-aluminum alloy target material provided with a cooling hole. The sunken titanium-aluminum alloy target material provided with the cooling hole comprises a target material body which is manufactured through a titanium-aluminum alloy, a sunken bottom surface, a mounting hole and a temperature decreasing hole, wherein the temperature decreasing hole communicates with the mounting hole in the target material body. The sunken titanium-aluminum alloy target material provided with the cooling hole further comprises a cooling base which is manufactured through brass, a mounting limiting, a draining hole and a hollow connecting bolt; and the connecting bolt and the mounting hole are installed in a matched manner. According to the sunken titanium-aluminum alloy target material provided with the cooling hole, the mounting hole, the temperature decreasing hole, an installing bolt and the draining hole are mutually matched to form an inner liquid cooling flowing channel which realizes one-time cooling in the target material; the matched contact surfaces of thetarget material body and a chassis material are smooth, so that the contact areas of the target material body and the chassis material are increased, and the contact heat dissipating efficiency is improved; and the technical problems such as complex positioning and mounting of a sunken target material, poor cooling effect, low density, color and hardness of forming crystal grains, and low inter-crystal structure uniformity in the prior art can be solved.

Description

technical field [0001] The invention relates to the technical field of coating processing and manufacturing, in particular to a titanium-aluminum alloy concave target material with cooling holes. Background technique [0002] The coating target is a sputtering source that forms various functional thin films on the substrate by sputtering under appropriate process conditions through magnetron sputtering, multi-arc ion plating or other types of coating systems. Various types of sputtered thin film materials have been widely used in semiconductor integrated circuits (VLSI), optical discs, flat-panel displays, and surface coatings on workpieces. Since the 1990s, the simultaneous development of sputtering targets and sputtering technology has greatly met the needs of the development of various new electronic components. For example, in the manufacturing process of semiconductor integrated circuits, copper conductor films with lower resistivity are used instead of aluminum film w...

AI Technical Summary

Problems solved by technology

[0005] At least one object of the present invention is to propose a titanium-aluminum alloy concave target with cooling holes, which solves the problems of complex positioning and installation of the concave target in the prior art, insufficient cooling effect, compactness, color and hardness of the formed grains Insufficient and poor uniformity of intergranular structure

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