Multilayer ceramic capacitor and preparation method thereof

A technology of multilayer ceramics and capacitors, which is applied in the direction of laminated capacitors, capacitors, fixed capacitors, etc., can solve the problems of incomplete removal of adhesives, decline in the density and uniformity of ceramic bodies, and achieve good consistency and high density. and good dielectric properties

Active Publication Date: 2018-11-23
GUANGDONG FENGHUA ADVANCED TECH HLDG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since the debonding is carried out on the larger volume of the third substrate, there is a problem that the binder co

Method used

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  • Multilayer ceramic capacitor and preparation method thereof
  • Multilayer ceramic capacitor and preparation method thereof
  • Multilayer ceramic capacitor and preparation method thereof

Examples

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Example

[0054] The first embodiment

[0055] An embodiment of the multilayer ceramic capacitor of the present invention, combined figure 1 The multilayer ceramic capacitor in this embodiment is prepared by the following method:

[0056] Step 1: The ceramic powder doped with the sintering aid, the binder, and the organic solvent are uniformly mixed to obtain a ceramic slurry, and then the ceramic slurry is used as a raw material to prepare a ceramic membrane.

[0057] In this embodiment, the operation of uniformly mixing the ceramic powder doped with the sintering aid, the binder, and the organic solvent is: the ball milling method is used to uniformly mix the ceramic powder doped with the sintering aid, the binder, and the organic solvent. , The milling time can be 10~16h.

[0058] In the ceramic slurry, the mass ratio of the ceramic powder doped with the sintering aid, the binder and the organic solvent is 10: (3-5): (6-9).

[0059] In this embodiment, the mass percentage of the sintering aid...

Example

[0098] Second embodiment

[0099] An embodiment of the multilayer ceramic capacitor of the present invention, the multilayer ceramic capacitor of this embodiment is prepared by the following method:

[0100] Steps 1 to 6 are the same as in the first embodiment.

[0101] Step 7: Grind the green block.

[0102] Using alumina balls or zirconia balls, and tap water as grinding media, the green block is ground by planetary milling or barrel grinding, so that all six faces of the green block are ground into inwardly concave surfaces. The ground green block is roughly rectangular and has six inwardly recessed faces.

[0103] The green block has a certain degree of plasticity and small hardness, it will not be broken when it is ground, and it is easier to grind it to the degree of surface depression, and the grinding efficiency is high.

[0104] Step 8: Place the ground green block on a setter plate, and then debond and sinter the green block to obtain a sintered block.

[0105] In the operation...

Example

[0111] The third embodiment

[0112] Steps 1 to 4 are the same as the first embodiment.

[0113] Step 5: Print the nickel paste on the ceramic film obtained in Step 1 to form an additional layer, and stack a plurality of ceramic films printed with the additional layer to obtain a second substrate.

[0114] In the operation of printing the nickel paste on the ceramic film to form an additional layer, the screen printing process is selected for printing. The thickness of the additional layer can be 2-5 μm.

[0115] Generally, the second substrate can be obtained by stacking 6 to 38 ceramic films printed with additional layers.

[0116] Steps 6 to 10 are the same as in the first embodiment. The side view of the sintered block in this embodiment is as Image 6 As shown, the side view of the ground sinter is as Figure 7 It should be noted that, since the sintered block of this embodiment contains nickel, magnetic separation can be used in step 9 to more easily separate the ceramic body fr...

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Abstract

The invention discloses a preparation method of a multilayer ceramic capacitor. A sintered block and a laminated body are mixed together and placed on a sintered plate, and then the laminated body issintered, so that the sintered component in the sintered block volatilizes to form a local atmosphere with high volatilization concentration around the laminated body, thereby preventing the excessivevolatilization of the sintered component in the laminated body, and making the sintered ceramic body uniform, compact and uniform. Each surface of the sintered block is inwardly concave. When the sintered block and the laminated body are mixed together, the sintered block and the laminated body cannot form large area contact, so the sintered ceramic body is not easy to adhere to the sintered block. The adhesive removing of the laminate body having smaller volume can be achieved completely, and the density and dielectric properties of the ceramic body are better.

Description

technical field [0001] The invention relates to a capacitor and a preparation method thereof, in particular to a multilayer ceramic capacitor and a preparation method thereof. Background technique [0002] The preparation of multilayer ceramic capacitors with copper inner electrodes requires the use of low-temperature sintered ceramic materials in order to co-fire with copper inner electrodes. Sintered dense. Since the sintering aid components tend to volatilize easily during high-temperature sintering, it is easy to cause the problem of deterioration of the consistency of the ceramic chips loaded on the same setter. Specifically, when the ceramic chips loaded on the same setter are sintered at high temperature, the ceramic chips with a higher loading density can hinder the volatilization due to the higher concentration of the volatile atmosphere of the firing aid components, so more of the firing aid components remain. The formation of a liquid phase in the ceramic chip p...

Claims

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Application Information

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IPC IPC(8): H01G4/30H01G4/12H01G4/005H01G4/232
CPCH01G4/005H01G4/1236H01G4/232H01G4/30
Inventor 陆亨李鸿刚卓金丽安可荣胡霞
Owner GUANGDONG FENGHUA ADVANCED TECH HLDG
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